TLE2426-Q1
- Qualified for Automotive Applications
- 1/2 VI Virtual Ground for Analog Systems
- Micropower Operation . . . 170 µA Typ, VI = 5 V
- Wide VI Range . . . 4 V to 40 V
- High Output-Current Capability
- Source . . . 20 mA Typ
- Sink . . . 20 mA Typ
- Excellent Output Regulation
- –102 µV Typ at IO = 0 to –10 mA
- +49 µV Typ at IO = 0 to +10 mA
- Low-Impedance Output . . . 0.0075 Typ
- Noise Reduction Pin
In signal-conditioning applications utilizing a single power source, a reference voltage equal to one-half the supply voltage is required for termination of all analog signal grounds. Texas Instruments presents a precision virtual ground whose output voltage is always equal to one-half the input voltage, the TLE2426 rail splitter.
The unique combination of a high-performance, micropower operational amplifier and a precision-trimmed divider on a single silicon chip results in a precise VO/VI ratio of 0.5 while sinking and sourcing current. The TLE2426 provides a low-impedance output with 20 mA of sink and source capability while drawing less than 280 µA of supply current over the full input range of 4 V to 40 V. A designer need not pay the price in terms of board space for a conventional signal ground consisting of resistors, capacitors, operational amplifiers, and voltage references. For increased performance, the 8-pin package provides a noise-reduction pin. With the addition of an external capacitor (CNR), peak-to-peak noise is reduced while line ripple rejection is improved.
Initial output tolerance for a single 5-V or 12-V system is better than 1% over the full 40-V input range. Ripple rejection exceeds 12 bits of accuracy. Whether the application is for a data acquisition front end, analog signal termination, or simply a precision voltage reference, the TLE2426 eliminates a major source of system error.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | The Rail Splitter Precision Virtual Ground datasheet (Rev. A) | 2008年 6月 23日 |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點