SLVA505A February   2012  – July 2024 DRV8800 , DRV8801 , DRV8802 , DRV8803 , DRV8804 , DRV8805 , DRV8806 , DRV8811 , DRV8812 , DRV8813 , DRV8814 , DRV8818 , DRV8821 , DRV8823 , DRV8824 , DRV8828 , DRV8829 , DRV8830 , DRV8832 , DRV8832-Q1 , DRV8833 , DRV8834 , DRV8835 , DRV8836 , DRV8837 , DRV8840 , DRV8841 , DRV8842 , DRV8843 , DRV8844 , DRV8870 , DRV8871 , DRV8872

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Factors Limiting the Maximum Output Current of a Motor Driver
    1. 1.1 Thermal Limitations
    2. 1.2 Overcurrent Protection (OCP) Limitations
    3. 1.3 Silicon and Package Limitations
    4. 1.4 PCB Limitations and Thermal Management Techniques
      1. 1.4.1 Exposed Pad Packages
      2. 1.4.2 Continuous Copper Planes
      3. 1.4.3 Copper Thickness
      4. 1.4.4 Thermal Vias
      5. 1.4.5 Summary of Thermal Management Techniques
    5. 1.5 Thermal Estimations
  5. 2TI Motor Driver OCP Operation
  6. 3TI Motor Driver Data Sheet Ratings
    1. 3.1 Description
    2. 3.2 Absolute Maximum Ratings
    3. 3.3 Recommended Operating Conditions
    4. 3.4 Thermal Information
    5. 3.5 Electrical Characteristics
  7. 4References
  8. 5Revision History

3.4 Thermal Information

The thermal information table provides data for calculation of how much the temperature of the die rises under a given set of power-dissipation conditions:

Table 3-3 Thermal Information
THERMAL METRICPWPRTYUNITS
16 PINS16 PINS
θJAJunction-to-ambient thermal resistance40.537.2°C/W
θJCtopJunction-to-case (top) thermal resistance32.934.3
θJBJunction-to-board thermal resistance28.815.3
ψJTJunction-to-top characterization parameter0.60.3
ψJBJunction-to-board characterization parameter11.515.4
θJCbotJunction-to-case (bottom) thermal resistance4.83.5

The θJA number for the chosen package gives an estimate of how much temperature rise is expected if the device was mounted on a standard JEDEC PCB. Other data is used to provide an estimate of the thermal resistance on the PCB. For details about this data, please refer to the information at PCB thermal calculator, including IC Package Thermal Metrics, and Using New Thermal Metrics, application notes.