Gehäuseinformationen
| Gehäuse | Pins NFBGA (ZAS) | 101 |
| Betriebstemperaturbereich (°C) -40 to 85 |
| Gehäusemenge | Träger 2.500 | LARGE T&R |
Merkmale von DS560MB410
- Quad-channel multi-protocol linear equalizer supporting up to 28-GBd (PAM4) and 32-GBd (NRZ) interfaces
- Suitable for up to CEI-56G, Ethernet (400 GbE), Fibre Channel (64GFC), InfiniBand™ (HDR), and CPRI/eCPRI PCB and copper cable applications
- Selectable CTLE boost profiles to compensate either PCB or cable loss
- Integrated 2×2 crosspoint with pin or register control for mux, fanout, and signal crossing
- Low power consumption: 160 mW / channel (typical)
- No heat sink required
- Linear equalization with CTLE for seamless support of CR/KR link training, auto-negotiation, and FEC pass-through
- Extends long-reach links by 18-dB+ beyond normal ASIC-to-ASIC capability at 13.28 GHz
- Eye expander for PAM-4 eye symmetry enhancement
- Low input-to-output latency: 80 ps (typical)
- Low additive random jitter
- Small 6.00 mm × 6.00 mm BGA package for easy flow-through routing
- No reference clock required
- Single 2.5-V ± 5% power supply
- –40°C to +85°C ambient temperature range
Beschreibung von DS560MB410
The DS560MB410 is a low-power, high-performance four-channel linear equalizer supporting multi-rate, multi-protocol interfaces up to 28 GBd using four-level pulse amplitude modulation (PAM4), or up to 32 GBd using non-return-to-zero (NRZ) modulation. It is used to extend the reach and robustness of high-speed serial links for backplane, midplane, and active copper cable (ACC) applications. The DS560MB410 can increase the reach between two ASICs by 18+ dB beyond the normal ASIC-to-ASIC reach.
Each channel operates independently with a user-selectable CTLE boost profile optimized for equalizing either PCB or copper cable loss profiles. The linear nature of the DS560MB410’s equalization preserves input signal characteristics traveling through the redriver. This transparency allows link partner ASICs to negotiate Tx equalizer coefficients freely during link training and to support individual lane Forward Error Correction (FEC) pass-through in mission mode with minimal effect on latency.
The DS560MB410 includes a full 2×2 crosspoint between each pair of adjacent channels to enable 2-to-1 multiplexing and 1-to-2 de-multiplexing for failover redundancy, 1-to-2 fanout for diagnostic monitoring, and signal crossover (NRZ only up to 32 GBd) for PCB routing flexibility. The crosspoint is controllable through pins or the SMBus register interface.
The DS560MB410’s small package dimensions and optimized high-speed signal escape are an excellent choice for small form-factor applications. Simplified equalization control, low power consumption, and ultra-low additive jitter make it suitable for chip-to-chip reach extension and signal distribution over backplanes and midplanes. The small 6.00 mm × 6.00 mm footprint easily fits in active copper cable (ACC) assembly applications without the need for a heat sink.
The DS560MB410 has a single power supply and minimal need for external components. These features reduce PCB routing complexity and bill of materials (BOM) cost. The DS560MB410 can be configured through SMBus or through an external EEPROM. Up to 16 devices can share a single EEPROM.