TXS0206A

AKTIV

TXS0206A MMC, SD-Karte, Memory Stick™ Spannungsumsetzungs-Transceiver

Produktdetails

Technology family TXS Applications MMC, SD Card, SDIO Rating Catalog Operating temperature range (°C) -40 to 85
Technology family TXS Applications MMC, SD Card, SDIO Rating Catalog Operating temperature range (°C) -40 to 85
DSBGA (YFP) 20 3.96 mm² 1.8 x 2.2
  • Level Translator
    • VCCA and VCCB Range of 1.1 V to 3.6 V
    • Fast Propagation Delay (4.4 ns Maximum
      When Translating Between 1.8 V and 3 V)
  • ESD Protection Exceeds JESD 22
    • 2500-V Human-Body Model (A114-B)
    • 250-V Machine Model (A115-A)
    • 1500-V Charged-Device Model (C101)
  • Level Translator
    • VCCA and VCCB Range of 1.1 V to 3.6 V
    • Fast Propagation Delay (4.4 ns Maximum
      When Translating Between 1.8 V and 3 V)
  • ESD Protection Exceeds JESD 22
    • 2500-V Human-Body Model (A114-B)
    • 250-V Machine Model (A115-A)
    • 1500-V Charged-Device Model (C101)

The TXS0206A is a level shifter for interfacing microprocessors with MultiMediaCards (MMCs), secure digital (SD) cards, and Memory Stick™ cards.

The voltage-level translator has two supply voltage pins. VCCA as well as VCCB can be operated over the full range of 1.1 V to 3.6 V. The TXS0206A enables system designers to easily interface applications processors or digital basebands to memory cards and SDIO peripherals operating at a different I/O voltage level.

The TXS0206A is offered in a 20-bump wafer chip scale package (WCSP). This package has dimensions of 1.96 mm × 1.56 mm, with a 0.4-mm ball pitch for effective board-space savings. Memory cards are widely used in mobile phones, PDAs, digital cameras, personal media players, camcorders, set-top boxes, etc. Low static power consumption and small package size make the TXS0206A an ideal choice for these applications.

The TXS0206A is a level shifter for interfacing microprocessors with MultiMediaCards (MMCs), secure digital (SD) cards, and Memory Stick™ cards.

The voltage-level translator has two supply voltage pins. VCCA as well as VCCB can be operated over the full range of 1.1 V to 3.6 V. The TXS0206A enables system designers to easily interface applications processors or digital basebands to memory cards and SDIO peripherals operating at a different I/O voltage level.

The TXS0206A is offered in a 20-bump wafer chip scale package (WCSP). This package has dimensions of 1.96 mm × 1.56 mm, with a 0.4-mm ball pitch for effective board-space savings. Memory cards are widely used in mobile phones, PDAs, digital cameras, personal media players, camcorders, set-top boxes, etc. Low static power consumption and small package size make the TXS0206A an ideal choice for these applications.

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Technische Dokumentation

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Typ Titel Datum
* Data sheet TXS0206A SD Card Voltage-Translation Transceiver datasheet (Rev. B) PDF | HTML 20 Jan 2016
Application note Schematic Checklist - A Guide to Designing with Auto-Bidirectional Translators PDF | HTML 12 Jul 2024
Application note Understanding Transient Drive Strength vs. DC Drive Strength in Level-Shifters (Rev. A) PDF | HTML 03 Jul 2024
Selection guide Voltage Translation Buying Guide (Rev. A) 15 Apr 2021
EVM User's guide TXS0206 Evaluation Module 08 Mai 2012

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Evaluierungsplatine

TXS0206AEVM — TXS0206A-Evaluierungsmodul

The TXS0206A EVM was created to allow simplified evaluation and prototyping without the need for full board development. This EVM provides peripheral header style pads for probing and signal connection to each device pin.

Benutzerhandbuch: PDF
Simulationsmodell

TXS0206A IBIS Model

SCEM551.ZIP (367 KB) - IBIS Model
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
DSBGA (YFP) 20 Ultra Librarian

Bestellen & Qualität

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  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

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