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AFE1256

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Circuito frontal analógico (AFE) de 256 canales para detectores de rayos X digitales de panel plano

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AFE1256

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Detalles del producto

Number of input channels 256 Resolution (bps) 16 Features Internal Reference Buffer, Nap Mode, Power Down, X-ray Interface type SPI Operating temperature range (°C) 0 to 70 Rating Catalog
Number of input channels 256 Resolution (bps) 16 Features Internal Reference Buffer, Nap Mode, Power Down, X-ray Interface type SPI Operating temperature range (°C) 0 to 70 Rating Catalog
COF (TDS) 314 1064 mm² 38 x 28 DIESALE (TD) — See data sheet
  • 256 Channels
  • On-Chip, 16-Bit ADC
  • Photodiode Short Immunity
  • Column Short Immunity
  • High Performance:
    • Noise: 758 e-RMS with 28-pF Sensor
      Capacitor in 1.2-pC Range
    • Integral Nonlinearity:
      ±2 LSB with Internal 16-Bit ADC
    • Minimum Scan Time:
      • 37.9 µs in Normal Mode
      • 20 µs in 2x Binning Mode
  • Integration:
    • Eight Selectable Full-Scale Ranges:
      0.15 pC (Min) to 9.6 pC (Max)
    • Built-In Correlated Double Sampler
    • 2x Binning (Averages Charge of Two Adjacent
      Channels) for Faster Throughput
    • Pipelined Integrate and Read: Allows Data
      Read During Integration
  • Flexibility:
    • Electron and Hole Integration
  • Low Power:
    • 2.9 mW/Ch with ADC
    • 2.3 mW/Ch without ADC
    • 0.1 mW/Ch in Nap Mode
    • Total Power-Down Feature
  • 22-mm × 5-mm Gold-Bump Die,
    Suitable for TCP and COF

Application

  • Flat-Panel, X-Ray Detector

All trademarks are the property of their respective owners.
  • 256 Channels
  • On-Chip, 16-Bit ADC
  • Photodiode Short Immunity
  • Column Short Immunity
  • High Performance:
    • Noise: 758 e-RMS with 28-pF Sensor
      Capacitor in 1.2-pC Range
    • Integral Nonlinearity:
      ±2 LSB with Internal 16-Bit ADC
    • Minimum Scan Time:
      • 37.9 µs in Normal Mode
      • 20 µs in 2x Binning Mode
  • Integration:
    • Eight Selectable Full-Scale Ranges:
      0.15 pC (Min) to 9.6 pC (Max)
    • Built-In Correlated Double Sampler
    • 2x Binning (Averages Charge of Two Adjacent
      Channels) for Faster Throughput
    • Pipelined Integrate and Read: Allows Data
      Read During Integration
  • Flexibility:
    • Electron and Hole Integration
  • Low Power:
    • 2.9 mW/Ch with ADC
    • 2.3 mW/Ch without ADC
    • 0.1 mW/Ch in Nap Mode
    • Total Power-Down Feature
  • 22-mm × 5-mm Gold-Bump Die,
    Suitable for TCP and COF

Application

  • Flat-Panel, X-Ray Detector

All trademarks are the property of their respective owners.

The AFE1256 is a 256-channel, analog front-end (AFE) designed to suit the requirements of flat-panel detectors (FPDs) based on digital X-ray systems. The device includes 256 integrators, a programmable gain amplifier (PGA) for full-scale, charge-level selection, a correlated double sampler (CDS) with dual banking, 256:4 analog multiplexers, and four 16-bit, successive-approximation register (SAR) analog-to-digital converters (ADCs) onboard. Serial data from the ADCs are available in SPI™ format.

Hardware-selectable integration polarity allows for the integration of positive or negative charge and provides more flexibility in system design. The Nap feature enables substantial power saving. This power savings is especially useful in battery-powered systems.

The device is available as a 22-mm × 5-mm gold-bumped die and a 38-mm × 28-mm, COF-314 TDS package in singulated forms.

To request a full data sheet or other design resources: request AFE1256

The AFE1256 is a 256-channel, analog front-end (AFE) designed to suit the requirements of flat-panel detectors (FPDs) based on digital X-ray systems. The device includes 256 integrators, a programmable gain amplifier (PGA) for full-scale, charge-level selection, a correlated double sampler (CDS) with dual banking, 256:4 analog multiplexers, and four 16-bit, successive-approximation register (SAR) analog-to-digital converters (ADCs) onboard. Serial data from the ADCs are available in SPI™ format.

Hardware-selectable integration polarity allows for the integration of positive or negative charge and provides more flexibility in system design. The Nap feature enables substantial power saving. This power savings is especially useful in battery-powered systems.

The device is available as a 22-mm × 5-mm gold-bumped die and a 38-mm × 28-mm, COF-314 TDS package in singulated forms.

To request a full data sheet or other design resources: request AFE1256
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Documentación técnica

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* Data sheet AFE1256 256-Channel, Analog Front-End for Digital X-Ray, Flat-Panel Detectors datasheet (Rev. D) PDF | HTML 26 may 2016
Analog Design Journal Selecting a multichannel ultra-low-current measurement IC PDF | HTML 18 mar 2022
EVM User's guide AFE1256COF EVM Introduction User Guide 05 nov 2013

Diseño y desarrollo

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Placa de evaluación

AFE1256EVM — Frontal analógico AFE AFE1256 de 256 canales para módulo de evaluación de detectores digitales de ra

The AFE1256EVM is a compact USB based evaluation kit for evaluating the AFE1256 COF, a 256-channel analog front-end. The EVM is self-contained with DACs and on board pattern generator built , greatly reducing its dependency on external equipment so all it needs is a power supply. The kit consists (...)

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PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
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Encapsulado Pines Símbolos CAD, huellas y modelos 3D
COF (TDS) 314 Ultra Librarian
DIESALE (TD) —
Se aplican los Términos y condiciones estándar de TI para los elementos de evaluación.

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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