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Detalles del producto

Number of channels 1 Output type Open-collector, Open-drain Propagation delay time (µs) 1.8 Vs (max) (V) 5.5 Vs (min) (V) 1.8 Rating Catalog Features Small Size Iq per channel (typ) (mA) 0.01 Vos (offset voltage at 25°C) (max) (mV) 4 Rail-to-rail In Operating temperature range (°C) -40 to 85 Input bias current (±) (max) (nA) 100 VICR (max) (V) 5.6 VICR (min) (V) -0.1
Number of channels 1 Output type Open-collector, Open-drain Propagation delay time (µs) 1.8 Vs (max) (V) 5.5 Vs (min) (V) 1.8 Rating Catalog Features Small Size Iq per channel (typ) (mA) 0.01 Vos (offset voltage at 25°C) (max) (mV) 4 Rail-to-rail In Operating temperature range (°C) -40 to 85 Input bias current (±) (max) (nA) 100 VICR (max) (V) 5.6 VICR (min) (V) -0.1
SOT-23 (DBV) 5 8.12 mm² 2.9 x 2.8 SOT-SC70 (DCK) 5 4.2 mm² 2 x 2.1
  • (VS = 1.8 V, TA = 25°C,
    Typical Values Unless Specified).
  • Single or Dual Supplies
  • Ultra Low Supply Current 9 µA Per Channel
  • Low Input Bias Current 10 nA
  • Low Input Offset Current 200 pA
  • Low Ensured VOS 4 mV
  • Propagation Delay 880 ns (20-mV Overdrive)
  • Input Common Mode Voltage Range 0.1 V
    Beyond Rails
  • LMV7272 is Available in DSBGA Package
  • (VS = 1.8 V, TA = 25°C,
    Typical Values Unless Specified).
  • Single or Dual Supplies
  • Ultra Low Supply Current 9 µA Per Channel
  • Low Input Bias Current 10 nA
  • Low Input Offset Current 200 pA
  • Low Ensured VOS 4 mV
  • Propagation Delay 880 ns (20-mV Overdrive)
  • Input Common Mode Voltage Range 0.1 V
    Beyond Rails
  • LMV7272 is Available in DSBGA Package

The LMV727x devices are rail-to-rail input low power comparators, characterized at supply voltages 1.8 V, 2.7 V, and 5 V. They consume as little as 9-µA supply current per channel while achieving a 800-ns propagation delay.

The LMV7271 and LMV7275 (single) are available in SC70 and SOT-23 packages. The LMV7272 (dual) is available in the DSBGA package. With these tiny packages, the PCB area can be significantly reduced. They are ideal for low voltage, low power, and space-critical designs.

The LMV7271 and LMV7272 both feature a push-pull output stage which allows operation with minimum power consumption when driving a load.

The LMV7275 features an open-drain output stage that allows for wired-OR configurations. The open-drain output also offers the advantage of allowing the output to be pulled to any voltage up to 5.5 V, regardless of the supply voltage of the LMV7275, which is useful for level-shifting applications.

The LMV727x devices are built with Texas Instruments’ advance submicron silicon-gate BiCMOS process. They all have bipolar inputs for improved noise performance, and CMOS outputs for rail-to-rail output swing.

The LMV727x devices are rail-to-rail input low power comparators, characterized at supply voltages 1.8 V, 2.7 V, and 5 V. They consume as little as 9-µA supply current per channel while achieving a 800-ns propagation delay.

The LMV7271 and LMV7275 (single) are available in SC70 and SOT-23 packages. The LMV7272 (dual) is available in the DSBGA package. With these tiny packages, the PCB area can be significantly reduced. They are ideal for low voltage, low power, and space-critical designs.

The LMV7271 and LMV7272 both feature a push-pull output stage which allows operation with minimum power consumption when driving a load.

The LMV7275 features an open-drain output stage that allows for wired-OR configurations. The open-drain output also offers the advantage of allowing the output to be pulled to any voltage up to 5.5 V, regardless of the supply voltage of the LMV7275, which is useful for level-shifting applications.

The LMV727x devices are built with Texas Instruments’ advance submicron silicon-gate BiCMOS process. They all have bipolar inputs for improved noise performance, and CMOS outputs for rail-to-rail output swing.

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Documentación técnica

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Tipo Título Fecha
* Data sheet LMV727x Single and Dual, 1.8-V Low Power Comparators With Rail-to-Rail Input datasheet (Rev. I) PDF | HTML 03 sep 2015
Application note Nano-Power Battery Monitoring in Personal Electronics 08 dic 2017
E-book The Signal e-book: A compendium of blog posts on op amp design topics 28 mar 2017

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

AMP-PDK-EVM — Módulo de evaluación del kit de desarrollo del rendimiento del amplificador

El kit de desarrollo del rendimiento (PDK) del amplificador es un kit de módulo de evaluación (EVM) para probar los parámetros comunes del amplificador operacional y es compatible con la mayoría de los amplificadores operacionales y comparadores. El kit del EVM ofrece una placa principal con varias (...)

Guía del usuario: PDF | HTML
Modelo de simulación

LMV7275 PSpice Model

SNOM555.ZIP (2 KB) - PSpice Model
Herramienta de simulación

PSPICE-FOR-TI — PSpice® para herramienta de diseño y simulación de TI

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Herramienta de simulación

TINA-TI — Programa de simulación analógica basado en SPICE

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
Guía del usuario: PDF
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
SOT-23 (DBV) 5 Ultra Librarian
SOT-SC70 (DCK) 5 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

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