SN74ABTH182502A

ACTIVO

Dispositivos de prueba de exploración con transceptores de bus universales de 18 bits

Detalles del producto

Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 18 IOL (max) (mA) 64 IOH (max) (mA) -15 Input type TTL-Compatible CMOS Output type 3-State Features Bus-hold, Damping resistors, Partial power down (Ioff), Very high speed (tpd 5-10ns) Technology family ABT Rating Catalog Operating temperature range (°C) -40 to 85
Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 18 IOL (max) (mA) 64 IOH (max) (mA) -15 Input type TTL-Compatible CMOS Output type 3-State Features Bus-hold, Damping resistors, Partial power down (Ioff), Very high speed (tpd 5-10ns) Technology family ABT Rating Catalog Operating temperature range (°C) -40 to 85
LQFP (PM) 64 144 mm² 12 x 12
  • Members of the Texas Instruments SCOPETM Family of Testability Products
  • Members of the Texas Instruments WidebusTM Family
  • Compatible With the IEEE Standard 1149.1-1990 (JTAG) Test Access Port
    and Boundary-Scan Architecture
  • UBTTM (Universal Bus Transceiver) Combines D-Type Latches and D-Type Flip-Flops for Operation in Transparent, Latched, or Clocked Mode
  • Bus Hold on Data Inputs Eliminates the Need for External Pullup Resistors
  • B-Port Outputs of 'ABTH182502A Devices Have Equivalent 25- Series Resistors, So No External Resistors Are Required
  • State-of-the-Art EPIC-IIBTM BiCMOS Design
  • One Boundary-Scan Cell Per I/O Architecture Improves Scan Efficiency
  • SCOPE Instruction Set
    • IEEE Standard 1149.1-1990 Required Instructions and Optional CLAMP and HIGHZ
    • Parallel-Signature Analysis at Inputs
    • Pseudo-Random Pattern Generation From Outputs
    • Sample Inputs/Toggle Outputs
    • Binary Count From Outputs
    • Device Identification
    • Even-Parity Opcodes
  • Packaged in 64-Pin Plastic Thin Quad Flat (PM) Packages Using 0.5-mm Center-to-Center Spacings and 68-Pin Ceramic Quad Flat (HV) Packages Using 25-mil Center-to-Center Spacings

    SCOPE, Widebus, UBT, and EPIC-IIB are trademarks of Texas Instruments Incorporated.

     

     

  • Members of the Texas Instruments SCOPETM Family of Testability Products
  • Members of the Texas Instruments WidebusTM Family
  • Compatible With the IEEE Standard 1149.1-1990 (JTAG) Test Access Port
    and Boundary-Scan Architecture
  • UBTTM (Universal Bus Transceiver) Combines D-Type Latches and D-Type Flip-Flops for Operation in Transparent, Latched, or Clocked Mode
  • Bus Hold on Data Inputs Eliminates the Need for External Pullup Resistors
  • B-Port Outputs of 'ABTH182502A Devices Have Equivalent 25- Series Resistors, So No External Resistors Are Required
  • State-of-the-Art EPIC-IIBTM BiCMOS Design
  • One Boundary-Scan Cell Per I/O Architecture Improves Scan Efficiency
  • SCOPE Instruction Set
    • IEEE Standard 1149.1-1990 Required Instructions and Optional CLAMP and HIGHZ
    • Parallel-Signature Analysis at Inputs
    • Pseudo-Random Pattern Generation From Outputs
    • Sample Inputs/Toggle Outputs
    • Binary Count From Outputs
    • Device Identification
    • Even-Parity Opcodes
  • Packaged in 64-Pin Plastic Thin Quad Flat (PM) Packages Using 0.5-mm Center-to-Center Spacings and 68-Pin Ceramic Quad Flat (HV) Packages Using 25-mil Center-to-Center Spacings

    SCOPE, Widebus, UBT, and EPIC-IIB are trademarks of Texas Instruments Incorporated.

     

     

The 'ABTH18502A and 'ABTH182502A scan test devices with 18-bit universal bus transceivers are members of the Texas Instruments SCOPE testability integrated-circuit family. This family of devices supports IEEE Standard 1149.1-1990 boundary scan to facilitate testing of complex circuit-board assemblies. Scan access to the test circuitry is accomplished via the 4-wire test access port (TAP) interface.

In the normal mode, these devices are 18-bit universal bus transceivers that combine D-type latches and D-type flip-flops to allow data flow in transparent, latched, or clocked modes. They can be used either as two 9-bit transceivers or one 18-bit transceiver. The test circuitry can be activated by the TAP to take snapshot samples of the data appearing at the device pins or to perform a self test on the boundary-test cells. Activating the TAP in the normal mode does not affect the functional operation of the SCOPE universal bus transceivers.

Data flow in each direction is controlled by output-enable ( and ), latch-enable (LEAB and LEBA), and clock (CLKAB and CLKBA) inputs. For A-to-B data flow, the device operates in the transparent mode when LEAB is high. When LEAB is low, the A-bus data is latched while CLKAB is held at a static low or high logic level. Otherwise, if LEAB is low, A-bus data is stored on a low-to-high transition of CLKAB. When is low, the B outputs are active. When is high, the B outputs are in the high-impedance state. B-to-A data flow is similar to A-to-B data flow but uses the , LEBA, and CLKBA inputs.

In the test mode, the normal operation of the SCOPE universal bus transceivers is inhibited and the test circuitry is enabled to observe and control the I/O boundary of the device. When enabled, the test circuitry performs boundary-scan test operations according to the protocol described in IEEE Standard 1149.1-1990.

 

Four dedicated test pins observe and control the operation of the test circuitry: test data input (TDI), test data output (TDO), test mode select (TMS), and test clock (TCK). Additionally, the test circuitry performs other testing functions such as parallel-signature analysis (PSA) on data inputs and pseudo-random pattern generation (PRPG) from data outputs. All testing and scan operations are synchronized to the TAP interface.

Improved scan efficiency is accomplished through the adoption of a one boundary-scan cell (BSC) per I/O pin architecture. This architecture is implemented in such a way as to capture the most pertinent test data. A PSA/COUNT instruction also is included to ease the testing of memories and other circuits where a binary count addressing scheme is useful.

Active bus-hold circuitry holds unused or floating data inputs at a valid logic level.

The B-port outputs of 'ABTH182502A, which are designed to source or sink up to 12 mA, include 25- series resistors to reduce overshoot and undershoot.

The SN54ABTH18502A and SN54ABTH182502A are characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABTH18502A and SN74ABTH182502A are characterized for operation from -40°C to 85°C.

 

 

A-to-B data flow is shown. B-to-A data flow is similar but uses OEBA\, LEBA, and CLKBA.

Output level before the indicated steady-state input conditions were established

The 'ABTH18502A and 'ABTH182502A scan test devices with 18-bit universal bus transceivers are members of the Texas Instruments SCOPE testability integrated-circuit family. This family of devices supports IEEE Standard 1149.1-1990 boundary scan to facilitate testing of complex circuit-board assemblies. Scan access to the test circuitry is accomplished via the 4-wire test access port (TAP) interface.

In the normal mode, these devices are 18-bit universal bus transceivers that combine D-type latches and D-type flip-flops to allow data flow in transparent, latched, or clocked modes. They can be used either as two 9-bit transceivers or one 18-bit transceiver. The test circuitry can be activated by the TAP to take snapshot samples of the data appearing at the device pins or to perform a self test on the boundary-test cells. Activating the TAP in the normal mode does not affect the functional operation of the SCOPE universal bus transceivers.

Data flow in each direction is controlled by output-enable ( and ), latch-enable (LEAB and LEBA), and clock (CLKAB and CLKBA) inputs. For A-to-B data flow, the device operates in the transparent mode when LEAB is high. When LEAB is low, the A-bus data is latched while CLKAB is held at a static low or high logic level. Otherwise, if LEAB is low, A-bus data is stored on a low-to-high transition of CLKAB. When is low, the B outputs are active. When is high, the B outputs are in the high-impedance state. B-to-A data flow is similar to A-to-B data flow but uses the , LEBA, and CLKBA inputs.

In the test mode, the normal operation of the SCOPE universal bus transceivers is inhibited and the test circuitry is enabled to observe and control the I/O boundary of the device. When enabled, the test circuitry performs boundary-scan test operations according to the protocol described in IEEE Standard 1149.1-1990.

 

Four dedicated test pins observe and control the operation of the test circuitry: test data input (TDI), test data output (TDO), test mode select (TMS), and test clock (TCK). Additionally, the test circuitry performs other testing functions such as parallel-signature analysis (PSA) on data inputs and pseudo-random pattern generation (PRPG) from data outputs. All testing and scan operations are synchronized to the TAP interface.

Improved scan efficiency is accomplished through the adoption of a one boundary-scan cell (BSC) per I/O pin architecture. This architecture is implemented in such a way as to capture the most pertinent test data. A PSA/COUNT instruction also is included to ease the testing of memories and other circuits where a binary count addressing scheme is useful.

Active bus-hold circuitry holds unused or floating data inputs at a valid logic level.

The B-port outputs of 'ABTH182502A, which are designed to source or sink up to 12 mA, include 25- series resistors to reduce overshoot and undershoot.

The SN54ABTH18502A and SN54ABTH182502A are characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABTH18502A and SN74ABTH182502A are characterized for operation from -40°C to 85°C.

 

 

A-to-B data flow is shown. B-to-A data flow is similar but uses OEBA\, LEBA, and CLKBA.

Output level before the indicated steady-state input conditions were established

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Documentación técnica

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Ver todo 22
Tipo Título Fecha
* Data sheet Scan Test Devices With 18-Bit Universal Bus Transceivers datasheet (Rev. E) 01 dic 1996
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 jul 2021
Application note An Overview of Bus-Hold Circuit and the Applications (Rev. B) 17 sep 2018
Selection guide Logic Guide (Rev. AB) 12 jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 dic 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 ene 2007
EVM User's guide LASP Demo Board User's Guide 01 nov 2005
Application note Programming CPLDs Via the 'LVT8986 LASP 01 nov 2005
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 jun 2004
Application note Quad Flatpack No-Lead Logic Packages (Rev. D) 16 feb 2004
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 ago 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 10 may 2002
Selection guide Advanced Bus Interface Logic Selection Guide 09 ene 2001
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 ago 1997
Application note Advanced BiCMOS Technology (ABT) Logic Characterization Information (Rev. B) 01 jun 1997
Application note Designing With Logic (Rev. C) 01 jun 1997
Application note Advanced BiCMOS Technology (ABT) Logic Enables Optimal System Design (Rev. A) 01 mar 1997
Application note Family of Curves Demonstrating Output Skews for Advanced BiCMOS Devices (Rev. A) 01 dic 1996
Application note Input and Output Characteristics of Digital Integrated Circuits 01 oct 1996
Application note Live Insertion 01 oct 1996
Application note Understanding Advanced Bus-Interface Products Design Guide 01 may 1996

Diseño y desarrollo

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Modelo de simulación

BSDL Model of SN74ABTH182502A

SCTM021.ZIP (3 KB) - BSDL Model
Modelo de simulación

SN74ABTH182502A IBIS Model (Rev. A)

SCBM037A.ZIP (22 KB) - IBIS Model
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
LQFP (PM) 64 Ultra Librarian

Pedidos y calidad

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  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
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  • Lugar de fabricación
  • Lugar de ensamblaje

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