These octal buffers and line drivers are designed specifically to
improve both the performance and density of 3-state memory address
drivers, clock drivers, and bus-oriented receivers and transmitters
by eliminating the need for 3-state overlap protection. With the
´AS756 and SN74AS757, these devices provide the choice of
selected combinations of inverting outputs, symmetrical active-low
output-enable (
) inputs, and
complementary OE and
inputs.
The SN54AS760 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ALS760 and SN74AS760 are characterized for operation from 0°C to 70°C.
| Tipo | Título | Fecha | ||
|---|---|---|---|---|
| * | Data sheet | Octal Buffers & Line Drivers With Open-Collector Outputs datasheet (Rev. A) | 01 ene 1995 | |
| Selection guide | Logic Guide (Rev. AB) | 12 jun 2017 | ||
| Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 02 dic 2015 | ||
| User guide | LOGIC Pocket Data Book (Rev. B) | 16 ene 2007 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 08 jul 2004 | ||
| Application note | TI IBIS File Creation, Validation, and Distribution Processes | 29 ago 2002 | ||
| Application note | Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) | 01 ago 1997 | ||
| Application note | Designing With Logic (Rev. C) | 01 jun 1997 | ||
| Application note | Input and Output Characteristics of Digital Integrated Circuits | 01 oct 1996 | ||
| Application note | Live Insertion | 01 oct 1996 | ||
| Application note | Advanced Schottky (ALS and AS) Logic Families | 01 ago 1995 |
Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.
El módulo de evaluación (EVM) 14-24-LOGIC-EVM está diseñado para admitir cualquier dispositivo lógico que esté en un empaquetado D, DW, DB, NS, PW, DYY o DGV de 14 a 24 pines.
| Encapsulado | Pines | Símbolos CAD, huellas y modelos 3D |
|---|---|---|
| PDIP (N) | 20 | Ultra Librarian |
| SOIC (DW) | 20 | Ultra Librarian |
El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.
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