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SN74ALVTH16827

OBSOLETO

Búferes de 20 canales, 2.3 V a 3.6 V con retención de bus, entradas CMOS compatibles con TTL y salid

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SN74ALVCH16827 ACTIVO Búferes de 20 canales, 1.65 V a 3.6 V con retención de bus y salidas de 3 estados Replacement

SN74ALVTH16827

OBSOLETO
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Detalles del producto

Technology family ALVT Supply voltage (min) (V) 2.3 Supply voltage (max) (V) 3.6 Number of channels 20 IOL (max) (mA) 64 Supply current (max) (µA) 6000 IOH (max) (mA) -64 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Bus-hold, Over-voltage tolerant inputs Rating Catalog Operating temperature range (°C) -40 to 85
Technology family ALVT Supply voltage (min) (V) 2.3 Supply voltage (max) (V) 3.6 Number of channels 20 IOL (max) (mA) 64 Supply current (max) (µA) 6000 IOH (max) (mA) -64 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Bus-hold, Over-voltage tolerant inputs Rating Catalog Operating temperature range (°C) -40 to 85
SSOP (DL) 56 190.647 mm² 18.42 x 10.35 TVSOP (DGV) 56 72.32 mm² 11.3 x 6.4
  • State-of-the-Art Advanced BiCMOS Technology (ABT) WidebusTM Design for 2.5-V and 3.3-V Operation and Low Static Power Dissipation
  • Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 2.3-V to 3.6-V VCC)
  • Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C
  • High Drive (-24/24 mA at 2.5-V and -32/64 mA at 3.3-V VCC)
  • Power Off Disables Outputs, Permitting Live Insertion
  • High-Impedance State During Power Up and Power Down Prevents Driver Conflict
  • Uses Bus Hold on Data Inputs in Place of External Pullup/Pulldown Resistors to Prevent the Bus From Floating
  • Auto3-State Eliminates Bus Current Loading When Output Exceeds VCC + 0.5 V
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model; and Exceeds 1000 V Using Charged-Device Model, Robotic Method
  • Flow-Through Architecture Facilitates Printed Circuit Board Layout
  • Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
  • Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), Thin Very Small-Outline (DGV) Packages, and 380-mil Fine-Pitch Ceramic Flat (WD) Package

    Widebus is a trademark of Texas Instruments Incorporated.
  • State-of-the-Art Advanced BiCMOS Technology (ABT) WidebusTM Design for 2.5-V and 3.3-V Operation and Low Static Power Dissipation
  • Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 2.3-V to 3.6-V VCC)
  • Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C
  • High Drive (-24/24 mA at 2.5-V and -32/64 mA at 3.3-V VCC)
  • Power Off Disables Outputs, Permitting Live Insertion
  • High-Impedance State During Power Up and Power Down Prevents Driver Conflict
  • Uses Bus Hold on Data Inputs in Place of External Pullup/Pulldown Resistors to Prevent the Bus From Floating
  • Auto3-State Eliminates Bus Current Loading When Output Exceeds VCC + 0.5 V
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model; and Exceeds 1000 V Using Charged-Device Model, Robotic Method
  • Flow-Through Architecture Facilitates Printed Circuit Board Layout
  • Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
  • Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), Thin Very Small-Outline (DGV) Packages, and 380-mil Fine-Pitch Ceramic Flat (WD) Package

    Widebus is a trademark of Texas Instruments Incorporated.

The 'ALVTH16827 devices are 20-bit buffers/line drivers designed for 2.5-V or 3.3-V VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

The devices are composed of two 10-bit sections with separate output-enable signals. For either 10-bit buffer section, the two output-enable (1OE1\ and 1OE2\, or 2OE1\ and 2OE2\) inputs must be low for the corresponding Y outputs to be active. If either output-enable input is high, the outputs of that 10-bit buffer section are in the high-impedance state.

When VCC is between 0 and 1.2 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.2 V, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

The SN54ALVTH16827 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ALVTH16827 is characterized for operation from -40°C to 85°C.

The 'ALVTH16827 devices are 20-bit buffers/line drivers designed for 2.5-V or 3.3-V VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

The devices are composed of two 10-bit sections with separate output-enable signals. For either 10-bit buffer section, the two output-enable (1OE1\ and 1OE2\, or 2OE1\ and 2OE2\) inputs must be low for the corresponding Y outputs to be active. If either output-enable input is high, the outputs of that 10-bit buffer section are in the high-impedance state.

When VCC is between 0 and 1.2 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.2 V, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

The SN54ALVTH16827 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ALVTH16827 is characterized for operation from -40°C to 85°C.

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Documentación técnica

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* Data sheet 2.5-V/3.3-V 20-Bit Buffers/Drivers With 3-State Outputs datasheet (Rev. E) 18 dic 1998

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje