(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified >performance and environmental limits.
The SN74BCT760 octal buffer and line driver is designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.
The SN74BCT760 is organized as two 4-bit buffers/line drivers with separate output-enable (OE) inputs. When OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state.
The device is characterized for operation over the full military temperature range of -55°C to 125°C.
| Tipo | Título | Fecha | ||
|---|---|---|---|---|
| * | Data sheet | SN74BCT760-EP datasheet (Rev. B) | 07 sep 2006 | |
| * | VID | SN74BCT760-EP VID V6206672 | 21 jun 2016 | |
| Application note | Implications of Slow or Floating CMOS Inputs (Rev. E) | 26 jul 2021 | ||
| Selection guide | Logic Guide (Rev. AB) | 12 jun 2017 | ||
| Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 02 dic 2015 | ||
| User guide | LOGIC Pocket Data Book (Rev. B) | 16 ene 2007 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 08 jul 2004 | ||
| Application note | TI IBIS File Creation, Validation, and Distribution Processes | 29 ago 2002 | ||
| Application note | Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) | 01 ago 1997 | ||
| Application note | Designing With Logic (Rev. C) | 01 jun 1997 | ||
| Application note | Input and Output Characteristics of Digital Integrated Circuits | 01 oct 1996 | ||
| Application note | Live Insertion | 01 oct 1996 |
Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.
| Encapsulado | Pines | Símbolos CAD, huellas y modelos 3D |
|---|---|---|
| SOIC (DW) | 20 | Ultra Librarian |
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