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Búferes y controladores no inversores

SN74HC244-EP

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Búferes de 8 canales, 2 V a 6 V con salidas de 3 estados de producto mejorado

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SN74HC244-EP

ACTIVO
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Detalles del producto

Technology family HC Supply voltage (min) (V) 2 Supply voltage (max) (V) 6 Number of channels 8 IOL (max) (mA) 7.8 Supply current (max) (µA) 80 IOH (max) (mA) -7.8 Input type Standard CMOS Output type 3-State Features Balanced outputs, Very high speed (tpd 5-10ns) Rating HiRel Enhanced Product Operating temperature range (°C) -55 to 125
Technology family HC Supply voltage (min) (V) 2 Supply voltage (max) (V) 6 Number of channels 8 IOL (max) (mA) 7.8 Supply current (max) (µA) 80 IOH (max) (mA) -7.8 Input type Standard CMOS Output type 3-State Features Balanced outputs, Very high speed (tpd 5-10ns) Rating HiRel Enhanced Product Operating temperature range (°C) -55 to 125
SOIC (DW) 20 131.84 mm² 12.8 x 10.3 TSSOP (PW) 20 41.6 mm² 6.5 x 6.4
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of –55° to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product Change Notification
  • Qualification Pedigree
  • 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
  • High-Current Outputs Drive up to 15 LSTTL Loads

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life.
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of –55° to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product Change Notification
  • Qualification Pedigree
  • 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
  • High-Current Outputs Drive up to 15 LSTTL Loads

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life.

These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. The ’HC244 are organized as two 4-bit buffers/drivers with separate output-enable (OE)\ inputs. When OE\ is low, the device passes noninverted data from the A inputs to the Y outputs. When OE\ is high, the outputs are in the high-impedance state.

These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. The ’HC244 are organized as two 4-bit buffers/drivers with separate output-enable (OE)\ inputs. When OE\ is low, the device passes noninverted data from the A inputs to the Y outputs. When OE\ is high, the outputs are in the high-impedance state.
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SN74LV244B-EP ACTIVO Búferes de 2 V a 5.5 V de 8 canales de producto mejorado con salidas de 3 estados Voltage range (1.65V to 5.5V), voltage translation capable

Documentación técnica

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Tipo Título Fecha
* Data sheet Octal Buffers and Line Drivers With 3-State Outputs datasheet (Rev. A) 06 ene 2004
* VID SN74HC244-EP VID V6203607 21 jun 2016
* Radiation & reliability report SN74HC244QDWREP Reliability Report 15 mar 2012
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 jul 2021
Selection guide Logic Guide (Rev. AB) 12 jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 dic 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 ene 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004
User guide Signal Switch Data Book (Rev. A) 14 nov 2003
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 ago 2002
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 jun 1997
Application note Designing With Logic (Rev. C) 01 jun 1997
Application note Input and Output Characteristics of Digital Integrated Circuits 01 oct 1996
Application note Live Insertion 01 oct 1996
Application note SN54/74HCT CMOS Logic Family Applications and Restrictions 01 may 1996
Application note Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc 01 abr 1996

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Encapsulado Pines Símbolos CAD, huellas y modelos 3D
SOIC (DW) 20 Ultra Librarian
TSSOP (PW) 20 Ultra Librarian
Se aplican los Términos y condiciones estándar de TI para los elementos de evaluación.

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

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