SN74LVC1G17-EP

ACTIVO

Búfer único de 1.65 V a 6.5 V con entradas de disparador Schmitt de producto mejorado

Detalles del producto

Technology family LVC Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 6.5 Number of channels 1 IOL (max) (mA) 32 Supply current (max) (µA) 10 IOH (max) (mA) -32 Input type Schmitt-Trigger Output type Push-Pull Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Rating HiRel Enhanced Product Operating temperature range (°C) -55 to 125
Technology family LVC Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 6.5 Number of channels 1 IOL (max) (mA) 32 Supply current (max) (µA) 10 IOH (max) (mA) -32 Input type Schmitt-Trigger Output type Push-Pull Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Rating HiRel Enhanced Product Operating temperature range (°C) -55 to 125
SOT-23 (DBV) 5 8.12 mm² 2.9 x 2.8 SOT-SC70 (DCK) 5 4.2 mm² 2 x 2.1
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of -55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Qualification Pedigree(1)
  • Supports 5-V VCC Operation
  • Max tpd of 4.6 ns at 3.3 V
  • Low Power Consumption, 10 µA Max ICC
  • ±24 mA Output Drive at 3.3 V
  • Ioff Supports Partial Power Down Mode Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

NanoStar, NanoFree are trademarks of Texas Instruments.

  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of -55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Qualification Pedigree(1)
  • Supports 5-V VCC Operation
  • Max tpd of 4.6 ns at 3.3 V
  • Low Power Consumption, 10 µA Max ICC
  • ±24 mA Output Drive at 3.3 V
  • Ioff Supports Partial Power Down Mode Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

NanoStar, NanoFree are trademarks of Texas Instruments.

This single Schmitt-trigger buffer is designed for 1.65-V to 5.5-V VCC operation.

The SN74LVC1G17 contains one buffer and performs the Boolean function Y = A. The device functions as an independent buffer, but because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT-) signals.

NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

This single Schmitt-trigger buffer is designed for 1.65-V to 5.5-V VCC operation.

The SN74LVC1G17 contains one buffer and performs the Boolean function Y = A. The device functions as an independent buffer, but because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT-) signals.

NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

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Documentación técnica

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Tipo Título Fecha
* Data sheet Single Schmitt-Trigger Buffer datasheet (Rev. A) 29 jun 2007
* VID SN74LVC1G17-EP VID V6206621 21 jun 2016
* Radiation & reliability report SN74LVC1G17MDBVREP Reliability Report (Rev. A) 06 jun 2012
* Radiation & reliability report SN74LVC1G17MDCKREP Reliability Report 07 may 2012
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 jul 2021
Selection guide Little Logic Guide 2018 (Rev. G) 06 jul 2018
Selection guide Logic Guide (Rev. AB) 12 jun 2017
Application note How to Select Little Logic (Rev. A) 26 jul 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 dic 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 ene 2007
Product overview Design Summary for WCSP Little Logic (Rev. B) 04 nov 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 jun 2004
User guide Signal Switch Data Book (Rev. A) 14 nov 2003
Application note Use of the CMOS Unbuffered Inverter in Oscillator Circuits 06 nov 2003
User guide LVC and LV Low-Voltage CMOS Logic Data Book (Rev. B) 18 dic 2002
Application note Texas Instruments Little Logic Application Report 01 nov 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 ago 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards 13 jun 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 22 may 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 10 may 2002
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS 27 mar 2002
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 01 dic 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 ago 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 jun 1997
Application note LVC Characterization Information 01 dic 1996
Application note Input and Output Characteristics of Digital Integrated Circuits 01 oct 1996
Application note Live Insertion 01 oct 1996
Design guide Low-Voltage Logic (LVC) Designer's Guide 01 sep 1996
Application note Understanding Advanced Bus-Interface Products Design Guide 01 may 1996

Diseño y desarrollo

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Encapsulado Pines Símbolos CAD, huellas y modelos 3D
SOT-23 (DBV) 5 Ultra Librarian
SOT-SC70 (DCK) 5 Ultra Librarian

Pedidos y calidad

Información incluida:
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  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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