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Búferes y controladores inversores

SN74LVC2G14

ACTIVO

Inversores de 2 canales, 1.65 V a 5.5 V con entradas de disparador Schmitt

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SN74LVC2G14

ACTIVO
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Detalles del producto

Technology family LVC Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 5.5 Number of channels 2 IOL (max) (mA) 32 IOH (max) (mA) -32 Supply current (max) (µA) 10 Input type Schmitt-Trigger Output type Push-Pull Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 125
Technology family LVC Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 5.5 Number of channels 2 IOL (max) (mA) 32 IOH (max) (mA) -32 Supply current (max) (µA) 10 Input type Schmitt-Trigger Output type Push-Pull Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 125
DSBGA (YZP) 6 2.1875 mm² 1.75 x 1.25 SOT-23 (DBV) 6 8.12 mm² 2.9 x 2.8 SOT-SC70 (DCK) 6 4.2 mm² 2 x 2.1
  • Available in the TI NanoFree Package
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 5.4 ns at 3.3 V
  • Low-Power Consumption, 10-μA Maximum ICC
  • ±24-mA Output Drive at 3.3 V
  • Typical VOLP (Output Ground Bounce)
    <0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot)
    >2 V at VCC = 3.3 V, TA = 25°C
  • Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
  • Support Translation Down
    (5 V to 3.3 V; 3.3 V to 1.8 V)
  • Latch-Up Performance Exceeds 100 mA
    Per JESD 78, Class II
  • Available in the TI NanoFree Package
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 5.4 ns at 3.3 V
  • Low-Power Consumption, 10-μA Maximum ICC
  • ±24-mA Output Drive at 3.3 V
  • Typical VOLP (Output Ground Bounce)
    <0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot)
    >2 V at VCC = 3.3 V, TA = 25°C
  • Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
  • Support Translation Down
    (5 V to 3.3 V; 3.3 V to 1.8 V)
  • Latch-Up Performance Exceeds 100 mA
    Per JESD 78, Class II

This dual Schmitt-trigger inverter is designed for
1.65-V to 5.5-V VCC operation.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

The SN74LVC2G14 device contains two inverters and performs the Boolean function Y = A. The device functions as two independent inverters, but because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT–) signals.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

For all available packages, see the orderable addendum at the end of the data sheet.

This dual Schmitt-trigger inverter is designed for
1.65-V to 5.5-V VCC operation.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

The SN74LVC2G14 device contains two inverters and performs the Boolean function Y = A. The device functions as two independent inverters, but because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT–) signals.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

For all available packages, see the orderable addendum at the end of the data sheet.
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Documentación técnica

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* Data sheet SN74LVC2G14 Dual Schmitt-Trigger Inverter datasheet (Rev. O) PDF | HTML 10 ago 2015
Product overview Generate a Power-On Reset Pulse PDF | HTML 14 jun 2023
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 jul 2021
Application brief Converting SPI to GPIO Through Digital Isolators PDF | HTML 16 oct 2020
Application brief Understanding Schmitt Triggers (Rev. A) PDF | HTML 22 may 2019
Selection guide Little Logic Guide 2018 (Rev. G) 06 jul 2018
Selection guide Logic Guide (Rev. AB) 12 jun 2017
Application note How to Select Little Logic (Rev. A) 26 jul 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 dic 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 ene 2007
Product overview Design Summary for WCSP Little Logic (Rev. B) 04 nov 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 jun 2004
User guide Signal Switch Data Book (Rev. A) 14 nov 2003
Application note Use of the CMOS Unbuffered Inverter in Oscillator Circuits 06 nov 2003
User guide LVC and LV Low-Voltage CMOS Logic Data Book (Rev. B) 18 dic 2002
Application note Texas Instruments Little Logic Application Report 01 nov 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 ago 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards 13 jun 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 22 may 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 10 may 2002
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS 27 mar 2002
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 01 dic 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 ago 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 jun 1997
Application note LVC Characterization Information 01 dic 1996
Application note Input and Output Characteristics of Digital Integrated Circuits 01 oct 1996
Application note Live Insertion 01 oct 1996
Design guide Low-Voltage Logic (LVC) Designer's Guide 01 sep 1996
Application note Understanding Advanced Bus-Interface Products Design Guide 01 may 1996

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

5-8-LOGIC-EVM — Módulo de evaluación lógica genérico para encapsulados DCK, DCT, DCU, DRL y DBV de 5 a 8 pines

Módulo de evaluación (EVM) flexible diseñado para admitir cualquier dispositivo que tenga un encapsulado DCK, DCT, DCU, DRL o DBV en un recuento de 5 a 8 pines.
Guía del usuario: PDF
No disponible en TI.com
Placa de evaluación

TMAG5110-5111EVM — Módulo de evaluación TMAG511x para bloqueos de efecto Hall de alta sensibilidad, 2D, canal doble

El TMAG5110-5111EVM es una placa de codificación giratoria con bloqueos de efecto Hall dobles que tienen circuitos independientes para las implementaciones de cuadratura (TMAG5110) y de velocidad y dirección (TMAG5111). Hay dos imanes diferentes y dos opciones de colocación de los imanes para (...)

Guía del usuario: PDF | HTML
No disponible en TI.com
Modelo de simulación

SN74LVC2G14 Behavioral SPICE Model

SCEM616.ZIP (7 KB) - PSpice Model
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Modelo de simulación

SN74LVC2G14 IBIS Model (Rev. B)

SCEM252B.ZIP (45 KB) - IBIS Model
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Design guide: PDF
Esquema: PDF
Diseños de referencia

TIDA-01162 — Diseño de referencia de comparación de accionamiento de motor de baja tensión integrado frente a dis

TIDA-01162 demonstrates the key differences between an integrated vs. discrete low-voltage motor drive solution. The discrete solution is implemented using two large external MOSFETs, while the integrated solution utilizes TI’s DRV8850 brushed DC motor driver.  Both designs are (...)
Design guide: PDF
Esquema: PDF
Diseños de referencia

TIDA-00641 — Diseño de referencia del controlador doble de micropasos de alta resolución

This reference design achieves a dual channel high resolution micro-stepping driver module using PWM current regulation method. Selectable micro-stepping level and current level is provided with the on-board switches. The PWM regulation scheme gives smooth phase current and ultra-low acoustic (...)
Test report: PDF
Esquema: PDF
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
DSBGA (YZP) 6 Ultra Librarian
SOT-23 (DBV) 6 Ultra Librarian
SOT-SC70 (DCK) 6 Ultra Librarian
Se aplican los Términos y condiciones estándar de TI para los elementos de evaluación.

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

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