SN74LVT543

ACTIVO

Transceptores octales registrados ABT de 3.3 V con salidas de 3 estados

Detalles del producto

Supply voltage (min) (V) 2.7 Supply voltage (max) (V) 3.6 Number of channels 8 IOL (max) (mA) 64 IOH (max) (mA) -32 Input type TTL/CMOS Output type LVTTL Features Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Technology family LVT Rating Catalog Operating temperature range (°C) -40 to 85
Supply voltage (min) (V) 2.7 Supply voltage (max) (V) 3.6 Number of channels 8 IOL (max) (mA) 64 IOH (max) (mA) -32 Input type TTL/CMOS Output type LVTTL Features Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Technology family LVT Rating Catalog Operating temperature range (°C) -40 to 85
SOIC (DW) 24 159.65 mm² 15.5 x 10.3
  • State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low Static Power Dissipation
  • Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
  • Support Unregulated Battery Operation Down to 2.7 V
  • Typical VOLP (Output Ground Bounce)< 0.8 V at VCC = 3.3 V, TA = 25°C
  • ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
  • Bus-Hold Data Inputs Eliminate the Need for External Pullup Resistors
  • Support Live Insertion
  • Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), and Ceramic (JT) DIPs
  • State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low Static Power Dissipation
  • Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
  • Support Unregulated Battery Operation Down to 2.7 V
  • Typical VOLP (Output Ground Bounce)< 0.8 V at VCC = 3.3 V, TA = 25°C
  • ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
  • Bus-Hold Data Inputs Eliminate the Need for External Pullup Resistors
  • Support Live Insertion
  • Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), and Ceramic (JT) DIPs

These octal transceivers are designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

The 'LVT543 contain two sets of D-type latches for temporary storage of data flowing in either direction. Separate latch-enable (or) and output-enable(or) inputs are provided for each register to permit independent control in either direction of data flow.

The A-to-B enable () input must be low in order to enter data from A or to output data from B. If is low and is low, the A-to-B latches are transparent; a subsequent low-to-high transition of puts the A latches in the storage mode. With and both low, the 3-state B outputs are active and reflect the data present at the output of the A latches. Data flow from B to A is similar but requires using the ,, and inputs.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

To ensure the high-impedance state during power up or power down, should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74LVT543 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.

The SN54LVT543 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74LVT543 is characterized for operation from -40°C to 85°C.

 

These octal transceivers are designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

The 'LVT543 contain two sets of D-type latches for temporary storage of data flowing in either direction. Separate latch-enable (or) and output-enable(or) inputs are provided for each register to permit independent control in either direction of data flow.

The A-to-B enable () input must be low in order to enter data from A or to output data from B. If is low and is low, the A-to-B latches are transparent; a subsequent low-to-high transition of puts the A latches in the storage mode. With and both low, the 3-state B outputs are active and reflect the data present at the output of the A latches. Data flow from B to A is similar but requires using the ,, and inputs.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

To ensure the high-impedance state during power up or power down, should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74LVT543 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.

The SN54LVT543 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74LVT543 is characterized for operation from -40°C to 85°C.

 

Descargar Ver vídeo con transcripción Video

Productos similares que pueden interesarle

open-in-new Comparar alternativas
Pin por pin con la misma funcionalidad que el dispositivo comparado
CD74ACT245 ACTIVO Transceptores de bus octal sin inversión con salidas de 3 estados Voltage range (4.5V to 5.5V)

Documentación técnica

star =Principal documentación para este producto seleccionada por TI
No se encontraron resultados. Borre su búsqueda y vuelva a intentarlo.
Ver todo 16
Tipo Título Fecha
* Data sheet 3.3-V ABT Octal Registered Transceivers With 3-State Outputs datasheet (Rev. D) 01 jul 1995
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 jul 2021
Selection guide Logic Guide (Rev. AB) 12 jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 dic 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 ene 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 ago 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 22 may 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 10 may 2002
Selection guide Advanced Bus Interface Logic Selection Guide 09 ene 2001
Application note LVT-to-LVTH Conversion 08 dic 1998
Application note LVT Family Characteristics (Rev. A) 01 mar 1998
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 ago 1997
Application note Input and Output Characteristics of Digital Integrated Circuits 01 oct 1996
Application note Live Insertion 01 oct 1996
Application note Understanding Advanced Bus-Interface Products Design Guide 01 may 1996

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

14-24-LOGIC-EVM — Módulo de evaluación genérico de productos lógicos para encapsulados D, DB, DGV, DW, DYY, NS y PW de

El módulo de evaluación 14-24-LOGIC-EVM (EVM) está diseñado para admitir cualquier dispositivo lógico que esté en un encapsulado D, DW, DB, NS, PW, DYY o DGV de 14 a 24 pines.

Guía del usuario: PDF | HTML
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
SOIC (DW) 24 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

Si tiene preguntas sobre la calidad, el paquete o el pedido de productos de TI, consulte el soporte de TI. ​​​​​​​​​​​​​​

Videos