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TX7332

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Transmisor de 3 niveles y 32 canales con formador de haces de transmisión integrado

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TX7332

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Detalles del producto

Device type Transmitter Number of input channels 32 Active supply current (typ) (mA) 10 Supply voltage (max) (V) 5.5 Operating temperature range (°C) 0 to 70 Interface type Serial Rating Catalog
Device type Transmitter Number of input channels 32 Active supply current (typ) (mA) 10 Supply voltage (max) (V) 5.5 Operating temperature range (°C) 0 to 70 Interface type Serial Rating Catalog
NFBGA (ZBX) 260 187 mm² 17 x 11
  • TX7332 supports:
    • 32-channel three-level pulser and active transmit/receive (T/R) switch
    • Very low power on-chip beamforming mode:
      • In receive-only mode: 0.45 mW/ch
      • In transmit-receive mode: 16.4 mW/ch
      • In CW mode: 160 mW/ch
      • In global power-down mode: 0.1 mW/ch
  • Three-level pulser:
    • Maximum output voltage: ±100 V
    • Minimum output voltage: ±1 V
    • Maximum output current: 1.2 A to 0.3 A
    • Maximum clamp current: 0.5 A to 0.12 A
    • Second harmonic : –45 dBc at 5 MHz
    • CW mode jitter: 100 fs measured from 100 Hz to 20 kHz
    • CW mode close-in phase noise: -154 dBc/Hz at 1 kHz offset for 5-MHz signal
    • –3-dB bandwidth with 2-kΩ || 120-pF load
      • 20 MHz (for ±100-V supply)
      • 25 MHz (for ±70-V supply)
  • Active T/R switch with:
    • ON, OFF control signals
    • Bandwidth: 50 MHz
    • HD2: –50 dBc
    • Turnon resistance: 24 Ω
    • Turnon time: 0.5 µs
    • Turnoff time: 1.75 µs
    • Transient glitch: 50 mVPP
  • Off-chip beamformer with:
    • Jitter cleaning using synchronization feature
    • Maximum synchronization clock frequency: 200 MHz
  • On-chip beamformer with:
    • Delay resolution: one beamformer clock period
    • Maximum delay: 213 beamformer clock period
    • Maximum beamformer clock speed: 200 MHz
    • On-chip RAM to store
      • 16 delay profiles
      • 32 pattern profiles
  • High-speed (100 MHz maximum) 1.8-V and 2.5-V CMOS serial programming interface
  • Automatic thermal shutdown
  • No specific power sequencing requirement
  • Small package: 260-pin NFBGA (17 mm × 11 mm) with 0.8-mm pitch
  • TX7332 supports:
    • 32-channel three-level pulser and active transmit/receive (T/R) switch
    • Very low power on-chip beamforming mode:
      • In receive-only mode: 0.45 mW/ch
      • In transmit-receive mode: 16.4 mW/ch
      • In CW mode: 160 mW/ch
      • In global power-down mode: 0.1 mW/ch
  • Three-level pulser:
    • Maximum output voltage: ±100 V
    • Minimum output voltage: ±1 V
    • Maximum output current: 1.2 A to 0.3 A
    • Maximum clamp current: 0.5 A to 0.12 A
    • Second harmonic : –45 dBc at 5 MHz
    • CW mode jitter: 100 fs measured from 100 Hz to 20 kHz
    • CW mode close-in phase noise: -154 dBc/Hz at 1 kHz offset for 5-MHz signal
    • –3-dB bandwidth with 2-kΩ || 120-pF load
      • 20 MHz (for ±100-V supply)
      • 25 MHz (for ±70-V supply)
  • Active T/R switch with:
    • ON, OFF control signals
    • Bandwidth: 50 MHz
    • HD2: –50 dBc
    • Turnon resistance: 24 Ω
    • Turnon time: 0.5 µs
    • Turnoff time: 1.75 µs
    • Transient glitch: 50 mVPP
  • Off-chip beamformer with:
    • Jitter cleaning using synchronization feature
    • Maximum synchronization clock frequency: 200 MHz
  • On-chip beamformer with:
    • Delay resolution: one beamformer clock period
    • Maximum delay: 213 beamformer clock period
    • Maximum beamformer clock speed: 200 MHz
    • On-chip RAM to store
      • 16 delay profiles
      • 32 pattern profiles
  • High-speed (100 MHz maximum) 1.8-V and 2.5-V CMOS serial programming interface
  • Automatic thermal shutdown
  • No specific power sequencing requirement
  • Small package: 260-pin NFBGA (17 mm × 11 mm) with 0.8-mm pitch

The TX7332 is a highly integrated, high-performance transmitter solution for ultrasound imaging system. The device has total 32 pulser circuits (PULS), 32 transmit/receive (T/R) switches, and supports both on-chip and off-chip beamformer (TxBF). The device also integrates on-chip floating power supplies that reduce the number of required high voltage power supplies.

The TX7332 has a pulser circuit that generates three-level high voltage pulses (up to ±100 V) that can be used to excite multiple channels of an ultrasound transducer. The device supports total 32 outputs. The maximum output current is configurable from 1.2 A to 0.3 A.

A T/R switch under OFF state protects the receiver circuit by providing high isolation between the high-voltage transmitter and the low-voltage receiver when the pulser is generating high-voltage pulses. When the transducer is receiving echo signals, the T/R switch turns ON and connects the transducer to the receiver. The ON/OFF operation of the T/R switch is either controlled by an external pin or controlled by on-chip beamforming engine in the device. The T/R switch offers 24-Ω impedance in the ON state.

Ultrasound transmission relies on the excitation of multiple transducer elements with the delay profile of the excitation across the different elements defining the direction of the transmission. Such an operation is referred to as transmit beamforming. The TX7332 supports staggered pulsing of the different channels, allowing for transmit beamforming. The device supports both off-chip and on-chip beamforming operation.

In the off-chip beamformer mode, the output transition of each pulser and TR switch ON/OFF operation is controlled by external control pins. To eliminate the effect of jitter from the external control signals, the device supports a synchronization feature. When the synchronization feature is enabled, the external control signals are latched using a low-jitter beamformer clock signal.

In the on-chip beamformer mode, the delay profile for the pulsing of the different channels is stored within the device. The device supports a transmit beamformer delay resolution of one beamformer clock period and a maximum delay of 213 beamformer clock periods. An internal pattern generator generates the output pulse patterns based on pattern profiles stored in a profile RAM. Up to 16 beamforming profiles and 32 pattern profiles can be stored in the profile RAM. On-chip beamforming mode reduces the number of control signals that must be routed from the FPGA to the device..

The TX7332 is available in a 17-mm × 11-mm 260-pin NFBGA package and is specified for operation from 0°C to 70°C.

The TX7332 is a highly integrated, high-performance transmitter solution for ultrasound imaging system. The device has total 32 pulser circuits (PULS), 32 transmit/receive (T/R) switches, and supports both on-chip and off-chip beamformer (TxBF). The device also integrates on-chip floating power supplies that reduce the number of required high voltage power supplies.

The TX7332 has a pulser circuit that generates three-level high voltage pulses (up to ±100 V) that can be used to excite multiple channels of an ultrasound transducer. The device supports total 32 outputs. The maximum output current is configurable from 1.2 A to 0.3 A.

A T/R switch under OFF state protects the receiver circuit by providing high isolation between the high-voltage transmitter and the low-voltage receiver when the pulser is generating high-voltage pulses. When the transducer is receiving echo signals, the T/R switch turns ON and connects the transducer to the receiver. The ON/OFF operation of the T/R switch is either controlled by an external pin or controlled by on-chip beamforming engine in the device. The T/R switch offers 24-Ω impedance in the ON state.

Ultrasound transmission relies on the excitation of multiple transducer elements with the delay profile of the excitation across the different elements defining the direction of the transmission. Such an operation is referred to as transmit beamforming. The TX7332 supports staggered pulsing of the different channels, allowing for transmit beamforming. The device supports both off-chip and on-chip beamforming operation.

In the off-chip beamformer mode, the output transition of each pulser and TR switch ON/OFF operation is controlled by external control pins. To eliminate the effect of jitter from the external control signals, the device supports a synchronization feature. When the synchronization feature is enabled, the external control signals are latched using a low-jitter beamformer clock signal.

In the on-chip beamformer mode, the delay profile for the pulsing of the different channels is stored within the device. The device supports a transmit beamformer delay resolution of one beamformer clock period and a maximum delay of 213 beamformer clock periods. An internal pattern generator generates the output pulse patterns based on pattern profiles stored in a profile RAM. Up to 16 beamforming profiles and 32 pattern profiles can be stored in the profile RAM. On-chip beamforming mode reduces the number of control signals that must be routed from the FPGA to the device..

The TX7332 is available in a 17-mm × 11-mm 260-pin NFBGA package and is specified for operation from 0°C to 70°C.

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Documentación técnica

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* Data sheet TX7332 Three-Level, 32-Channel Transmitter With 1.2-A Pulser, T/R Switch, and Integrated Transmit Beamformer datasheet PDF | HTML 19 mar 2019
Product overview Optimizing the Size of Handheld Ultrasound Front-End Circuit Designs PDF | HTML 15 dic 2023
Application note Designing High Voltage Power Supply for Ultrasound Smart Probes (Rev. A) PDF | HTML 16 may 2023
Application note Smart Ultrasound Probes Solution 19 jul 2019

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

TX7332EVM — Módulo de evaluación de transmisor de 32 canales de 3 niveles con formador de haces de transmisión i

El módulo de evaluación (EVM) TX7332 evalúa el dispositivo TX7332 y sus características.

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Controlador o biblioteca

TX7332-DESIGN — TX7332 design files

The full data sheet and other design resources for this device are available here.
Productos y hardware compatibles

Productos y hardware compatibles

Productos
AFE de ultrasonido
TX7332 — Transmisor de 3 niveles y 32 canales con formador de haces de transmisión integrado
Desarrollo de hardware
Placa de evaluación
TX7332EVM — Módulo de evaluación de transmisor de 32 canales de 3 niveles con formador de haces de transmisión i
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Modelo de simulación

TX7332 IBIS Model

SBOMAX8.ZIP (86 KB) - IBIS Model
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Disposición de la PCB

TX7332 Example PCB Layout

SBOR018.ZIP (27767 KB)
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Herramienta de simulación

PSPICE-FOR-TI — PSpice® para herramienta de diseño y simulación de TI

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
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Encapsulado Pines Símbolos CAD, huellas y modelos 3D
NFBGA (ZBX) 260 Ultra Librarian
Se aplican los Términos y condiciones estándar de TI para los elementos de evaluación.

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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