Inicio Lógica y traducción de voltaje Traductores de tensión y desplazadores de nivel Traductores de tensión con control de dirección
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Lógica y traducción de voltaje
Traductores de tensión y desplazadores de nivel
Traductores de tensión con control de dirección
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TXV0108-Q1

ACTIVO

Convertidor de tensión de 8 canales con control de dirección y doble alimentación para automoción

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TXV0108-Q1

ACTIVO
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Detalles del producto

Technology family AVC Applications GPIO, JTAG, SPI, UART Bits (#) 8 High input voltage (min) (V) 1.08 High input voltage (max) (V) 3.6 Vout (min) (V) 1.65 Vout (max) (V) 3.63 Data rate (max) (Mbps) 0.25 IOH (max) (mA) -12 IOL (max) (mA) 12 Supply current (max) (µA) 16 Features Output enable, Overvoltage tolerant inputs, Partial power down (Ioff), Vcc isolation Input type Standard CMOS Output type 3-State Rating Automotive Operating temperature range (°C) -40 to 125
Technology family AVC Applications GPIO, JTAG, SPI, UART Bits (#) 8 High input voltage (min) (V) 1.08 High input voltage (max) (V) 3.6 Vout (min) (V) 1.65 Vout (max) (V) 3.63 Data rate (max) (Mbps) 0.25 IOH (max) (mA) -12 IOL (max) (mA) 12 Supply current (max) (µA) 16 Features Output enable, Overvoltage tolerant inputs, Partial power down (Ioff), Vcc isolation Input type Standard CMOS Output type 3-State Rating Automotive Operating temperature range (°C) -40 to 125
VQFN (RGY) 24 19.25 mm² 5.5 x 3.5

  • Configurable design allows each port to operate with a power supply range from 1.14V to 3.6V

  • Supports up to 500Mbps for 1.65V to 3.6V
  • AEC-Q100 qualified for automotive applications
  • Meets RGMII 2.0 timing specifications:
    • < 750ps rise and fall time
    • < ± 5 % duty cycle distortion
    • < ± 400ps channel to channel skew
    • Up to 250Mbps/channel
  • Integrated 10Ω damping output resistor to minimize signal reflections
  • High drive strength (up to 12mA at 3.6V)
  • Fully configurable symmetric dual-rail design
  • Optimal signal integrity performance with 390ps peak-to-peak jitter for 1.8V to 3.3V
  • Features VCC isolation and VCC disconnect
  • Ioff supports partial-power-down mode operation
  • Latch-up performance exceeds 100mA per JESD 78, Class II
  • ESD protection exceeds JESD 22:
    • 2000-V Human-Body Model
    • 1000-V Charged-Device Model
  • Low power consumption:
    • 10µA maximum (25°C)
    • 20µA maximum (–40°C to 125°C)
  • Operating temperature from –40°C to +125°C
  • Pin compatible with SN74AVC8T245 (VQFN)
  • Available in wettable flank VQFN (RGY) package

  • Configurable design allows each port to operate with a power supply range from 1.14V to 3.6V

  • Supports up to 500Mbps for 1.65V to 3.6V
  • AEC-Q100 qualified for automotive applications
  • Meets RGMII 2.0 timing specifications:
    • < 750ps rise and fall time
    • < ± 5 % duty cycle distortion
    • < ± 400ps channel to channel skew
    • Up to 250Mbps/channel
  • Integrated 10Ω damping output resistor to minimize signal reflections
  • High drive strength (up to 12mA at 3.6V)
  • Fully configurable symmetric dual-rail design
  • Optimal signal integrity performance with 390ps peak-to-peak jitter for 1.8V to 3.3V
  • Features VCC isolation and VCC disconnect
  • Ioff supports partial-power-down mode operation
  • Latch-up performance exceeds 100mA per JESD 78, Class II
  • ESD protection exceeds JESD 22:
    • 2000-V Human-Body Model
    • 1000-V Charged-Device Model
  • Low power consumption:
    • 10µA maximum (25°C)
    • 20µA maximum (–40°C to 125°C)
  • Operating temperature from –40°C to +125°C
  • Pin compatible with SN74AVC8T245 (VQFN)
  • Available in wettable flank VQFN (RGY) package

The TXV0108-Q1 is an 8-bit, dual-supply direction controlled low-skew, low-jitter voltage translation device. This device can be used for redriving, voltage translation, and power isolation when implementing skew sensitive interface, such as RGMII between Ethernet MAC and PHY devices. The Ax I/O pins and control pins (DIR, OE) are referenced to VCCA logic levels, and Bx I/O pins are referenced to VCCB logic levels. This device has improved channel-to-channel skew, duty cycle distortion and symmetric rise and fall time for applications requiring strict timing conditions.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, thus preventing damaging current backflow through the device when it is powered down.

The VCC isolation feature is designed so that if either VCC supply is at or near 0V both ports will switch to a high-impedance state. This feature enables power isolation for communications across multiple MACs and PHYs, and is beneficial in situations where MACs and PHYs are powered up asynchronously preventing current backflow between devices.

A High on DIR allows data transmission from A to B while a Low on DIR allows data transmission from B to A when OE is set to Low. When OE is set to High, both Ax and Bx pins will be forced into a high-impedance state. See Device Functional Modes for a summary of the operation of the control logic.

The TXV0108-Q1 is an 8-bit, dual-supply direction controlled low-skew, low-jitter voltage translation device. This device can be used for redriving, voltage translation, and power isolation when implementing skew sensitive interface, such as RGMII between Ethernet MAC and PHY devices. The Ax I/O pins and control pins (DIR, OE) are referenced to VCCA logic levels, and Bx I/O pins are referenced to VCCB logic levels. This device has improved channel-to-channel skew, duty cycle distortion and symmetric rise and fall time for applications requiring strict timing conditions.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, thus preventing damaging current backflow through the device when it is powered down.

The VCC isolation feature is designed so that if either VCC supply is at or near 0V both ports will switch to a high-impedance state. This feature enables power isolation for communications across multiple MACs and PHYs, and is beneficial in situations where MACs and PHYs are powered up asynchronously preventing current backflow between devices.

A High on DIR allows data transmission from A to B while a Low on DIR allows data transmission from B to A when OE is set to Low. When OE is set to High, both Ax and Bx pins will be forced into a high-impedance state. See Device Functional Modes for a summary of the operation of the control logic.
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Documentación técnica

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* Data sheet TXV0108-Q1 Automotive 8-Bit Direction Controlled Low-Skew, Low-Jitter Voltage Translator or Buffer datasheet (Rev. B) PDF | HTML 12 abr 2024
Application note Schematic Checklist - A Guide to Designing With Fixed or Direction Control Translators PDF | HTML 02 oct 2024
Application note Schematic Checklist - A Guide to Designing with Auto-Bidirectional Translators PDF | HTML 12 jul 2024
Application note Understanding Transient Drive Strength vs. DC Drive Strength in Level-Shifters (Rev. A) PDF | HTML 03 jul 2024
Application brief Enabling AI Accelerators with Voltage Level Translation PDF | HTML 01 may 2024
Functional safety information TXV0108-Q1 Functional Safety, FIT Rate, Failure Mode Distribution and Pin FMA PDF | HTML 05 feb 2024
EVM User's guide TXV010xEVM Evaluation Module User's Guide PDF | HTML 05 feb 2024
Application note Overcoming Design Challenges - Implementing High Performance Interfaces PDF | HTML 12 dic 2023
Application brief Solving Power Sequencing Challenges for Ethernet RGMII Communications PDF | HTML 27 oct 2023
Application brief Supporting Time and Skew Sensitive Interfaces with TI's TXV Level-Shifter PDF | HTML 27 oct 2023
Application brief Enabling Industrial and Automotive Ethernet RGMII Interfaces with Voltage Transl PDF | HTML 02 ago 2023

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

14-24-NL-LOGIC-EVM — Módulo de evaluación genérico de productos lógicos para encapsulados sin conductores de 14 a 24 pine

14-24-NL-LOGIC-EVM es un módulo de evaluación (EVM) flexible diseñado para admitir cualquier dispositivo lógico o de traducción que tenga un encapsulado BQA, BQB, RGY, RSV, RJW o RHL de 14 a 24 pines.

Guía del usuario: PDF | HTML
No disponible en TI.com
Placa de evaluación

TXV0108-EVM — Módulo de evaluación TXV0108

El módulo de evaluación (EVM) TXV0108 es una plataforma fácil de usar para evaluar la funcionalidad y el rendimiento del dispositivo TXV0108. El EVM dispone de circuitos y puentes opcionales para configurar el dispositivo para diferentes aplicaciones. El dispositivo ofrece opciones de conversión (...)
Guía del usuario: PDF | HTML
No disponible en TI.com
Modelo de simulación

TXV0108 IBIS Model

SCEM798.ZIP (44 KB) - IBIS Model
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Encapsulado Pines Símbolos CAD, huellas y modelos 3D
VQFN (RGY) 24 Ultra Librarian
Se aplican los Términos y condiciones estándar de TI para los elementos de evaluación.

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

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