UCC27424-EP
- Industry-Standard Pinout
- Enable Functions for Each Driver
- High Current-Drive Capability of ±4 A
- Unique Bipolar and CMOS True-Drive Output
Stage Provides High Current at MOSFET Miller
Thresholds - TTL-/CMOS-Compatible Inputs Independent of
Supply Voltage - 20-ns Typical Rise and 15-ns Typical Fall Times
With 1.8-nF Load - Typical Propagation Delay Times of 25 ns
With Input Falling and 35 ns With Input Rising - 4.5-V to 15-V Supply Voltage
- Dual Outputs can be Paralleled for Higher Drive
Current - Available in Thermally-Enhanced MSOP
PowerPAD™ Package With 4.7°C/W RθJC - Supports Defense, Aerospace, and Medical
Applications- Controlled Baseline
- One Assembly/Test Site
- One Fabrication Site
- Extended Product Life Cycle
- Extended Product-Change Notification
- Product Traceability
- APPLICATIONS
- Switch-Mode Power Supplies
- DC/DC Converters
- Motor Controllers
- Line Drivers
- Class-D Switching Amplifiers
All other trademarks are the property of their respective owners
The UCC27423 and UCC27424 high-speed MOSFET drivers can deliver large peak currents into capacitive loads. Two standard logic options are offered – dual inverting and dual noninverting drivers. The UCC27424 thermally-enhanced 8-pin PowerPAD™ MSOP package (DGN) drastically lowers the thermal resistance to improve long-term reliability. The UCC27423 is offered in a standard SOIC-8 (D) package.
Using a design that inherently minimizes shoot-through current, this driver delivers 4 A of current where it is needed most – at the Miller plateau region during the MOSFET switching transition. A unique bipolar and MOSFET hybrid output stage in parallel also allows efficient current sourcing and sinking at low supply voltages.
The UCC27423 and UCC27424 provide enable (ENB) functions to better control the operation of the driver applications. ENBA and ENBB are implemented on pins 1 and 8, which previously were left unused in the industry-standard pinout. ENBA and ENBB are pulled up internally to VDD for active-high logic and can be left open for standard operation.
技術資料
設計および開発
その他のアイテムや必要なリソースを参照するには、以下のタイトルをクリックして詳細ページをご覧ください。
PSPICE-FOR-TI — TI Design / シミュレーション・ツール向け PSpice®
設計とシミュレーション向けの環境である PSpice for TI (...)
パッケージ | ピン数 | CAD シンボル、フットプリント、および 3D モデル |
---|---|---|
HVSSOP (DGN) | 8 | Ultra Librarian |
購入と品質
- RoHS
- REACH
- デバイスのマーキング
- リード端子の仕上げ / ボールの原材料
- MSL 定格 / ピーク リフロー
- MTBF/FIT 推定値
- 使用原材料
- 認定試験結果
- 継続的な信頼性モニタ試験結果
- ファブの拠点
- 組み立てを実施した拠点
推奨製品には、この TI 製品に関連するパラメータ、評価基板、またはリファレンス デザインが存在する可能性があります。