ISO7821LL
- Complies with TIA/EIA-644-A LVDS Standard
- Signaling Rate: Up to 100 Mbps
- Wide Supply Range: 2.25 V to 5.5 V
- Wide Temperature Range: –55°C to +125°C Ambient
- Low Power Consumption, per Channel at 100 Mbps:
- Typical 9.3-mA (ISO7820LL)
- Typical 9.5-mA (ISO7821LL)
- Low Propagation Delay: 17-ns Typical
- Industry leading CMTI (min): ±100 kV/μs
- Robust Electromagnetic Compatibility (EMC)
- System-Level ESD, EFT, and Surge Immunity
- Low Emissions
- Isolation Barrier Life: > 40 Years
- Wide Body and Extra-Wide Body SOIC-16 Package Options
- Isolation Surge Withstand Voltage 12800 VPK
- Safety-Related Certifications:
- 8000-VPK Reinforced Isolation per DIN V VDE V 0884-10 (VDE V 0884-10):2006-12
- 5700-VRMS Isolation for 1 minute per UL 1577
- CSA Component Acceptance Notice 5A, IEC 60950–1 and IEC 60601–1 End Equipment Standards
- TUV Certification per EN 61010-1 and EN 60950-1
- GB4943.1-2011 CQC Certification
- All Certifications are Planned
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The ISO782xLL family of devices is a high-performance, isolated dual-LVDS buffer with 8000-VPK isolation voltage. This device provides high electromagnetic immunity and low emissions at low-power consumption, while isolating the LVDS bus signal. Each isolation channel has an LVDS receive and transmit buffer separated by silicon dioxide (SiO2) insulation barrier.
The ISO7820LL device has two forward-direction channels. The ISO7821LL device has one forward and one reverse-direction channel.
Through innovative chip design and layout techniques, the electromagnetic compatibility of the ISO782xLL family of devices has been significantly enhanced to ease system-level ESD, EFT, surge, and emission compliance.
The ISO782xLL family of devices is available in 16-pin SOIC wide-body (DW) package and extra-wide body (DWW) packages.
For all available packages, see the orderable addendum at the end of the data sheet.기술 자료
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
ISO7821LLEVM — 고성능 절연 듀얼 LVDS 양방향 버퍼 평가 모듈
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
SOIC (DW) | 16 | Ultra Librarian |
SOIC (DWW) | 16 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.