PGA460-Q1
- Fully integrated solution for ultrasonic sensing
- AEC-Q100 qualified with the following results:
- Device temperature grade 2: –40°C to +105°C ambient operating temperature
- Device HBM ESD classification level 2
- Device CDM ESD classification level C4B
- Complimentary low-side drivers with configurable current limit supporting both transformer based and direct drive topology for transducer excitation
- Single transducer for both burst/listen or a transducer pair, one for burst and the other for listen operation
- Low-noise receiver with programmable 6-point time-varying gain (32 to 90 dB) with DSP (BPF, demodulation) for echo envelope detection
- Two presets of 12-point time-varying threshold for object detection
- Timers to measure multiple echo distance and duration
- Integrated temperature sensor
- Record time for object detection up to 11 m
- 128 bytes of RAM for echo recording
- 42 bytes of user EEPROM to store configuration for fast initialization
- One-wire high-voltage time-command interface or USART asynchronous interface
- CMOS level USART interface
- Sensor diagnostics (decay frequency and time, excitation voltage), supply, and transceiver diagnostics
The PGA460-Q1 device is a highly-integrated system on-chip ultrasonic transducer driver and signal conditioner with an advanced DSP core. The device has a complimentary low-side driver pair that can drive a transducer either in a transformer based topology using a step-up transformer or in a direct-drive topology using external high-side FETs. The device can receive and condition the reflected echo signal for reliable object detection. This feature is accomplished using an analog front-end (AFE) consisting of a low-noise amplifier followed by a programmable time-varying gain stage feeding into an ADC. The digitized signal is processed in the DSP core for both near-field and far-field object detection using time-varying thresholds.
The main communication with an external controller is achieved by either a time-command interface (TCI) or a one-wire USART asynchronous interface on the IO pin, or a CMOS-level USART interface on the RXD and TXD pins. The PGA460-Q1 can be put in ultra-low quiescent current low-power mode to reduce power consumption when not in use and can be woken up by commands on the communication interfaces.
The PGA460-Q1 also includes on-chip system diagnostics which monitor transducer voltage during burst, frequency and decay time of transducer to provide information about the integrity of the excitation as well as supply-side and transceiver-side diagnostics for overvoltage, undervoltage, overcurrent and short-circuit scenarios.
기술 자료
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
BOOSTXL-PGA460 — PGA460-Q1 변환기가 탑재된 초음파 센서 신호 조절기 평가 모듈
PGA460PSM-EVM — PGA460 초음파 근접 감지 평가 모듈
For shipments to Europe, please order the equivalent signal conditioning device BOOSTXL-PGA460
The PGA460PSM evaluation module (EVM) is a small-form-factor solution showcasing double-sided printed circuit board (PCB) spacing and the supporting component requirements for the PGA460 ultrasonic (...)
PGA460 Mono-static Transducer Transformer Driver Small Form Factor Design File
PGA460 Mono-static Transducer Half-Bridge Driver Small Form Factor Design File
PGA460 Mono-static Transducer Full-Bridge Driver Small Form Factor Design File
PGA460 Mono-static Transducer Transformer Driver Ultra-Small Design File
PGA460 Mono-Static Transducer Half-Bridge Driver Ultra-Small Design File
PGA460 Bi-static Transducer Transformer Driver Small Form Factor Design File
PGA460 Bi-static Transducer Half-Bridge Driver Small Form Factor Design File
PGA460 Bi-static Transducer Full-Bridge Driver Small Form Factor Design File
TIDA-01424 — 오토모티브 초음파 킥 투 오픈(Kick to Open) 레퍼런스 디자인
TIDA-01597 — 주차 보조를 위한 차량용 초음파 감지 모듈 레퍼런스 설계
TIDA-060024 — 초음파 근접 감지 모듈(PSM) 레퍼런스 설계
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
TSSOP (PW) | 16 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.