제품 상세 정보

Type Integrated Features Transformer drive Gain (min) (dB) 32 Gain (max) (dB) 90 Number of input channels 1 Supply voltage (min) (V) 6 Supply voltage (max) (V) 28 Operating temperature range (°C) -40 to 105 Interface type OWU (one-wire UART), TCI (time-command interface), UART, USART Rating Automotive
Type Integrated Features Transformer drive Gain (min) (dB) 32 Gain (max) (dB) 90 Number of input channels 1 Supply voltage (min) (V) 6 Supply voltage (max) (V) 28 Operating temperature range (°C) -40 to 105 Interface type OWU (one-wire UART), TCI (time-command interface), UART, USART Rating Automotive
TSSOP (PW) 16 32 mm² 5 x 6.4
  • Fully integrated solution for ultrasonic sensing
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 2: –40°C to +105°C ambient operating temperature
    • Device HBM ESD classification level 2
    • Device CDM ESD classification level C4B
  • Complimentary low-side drivers with configurable current limit supporting both transformer based and direct drive topology for transducer excitation
  • Single transducer for both burst/listen or a transducer pair, one for burst and the other for listen operation
  • Low-noise receiver with programmable 6-point time-varying gain (32 to 90 dB) with DSP (BPF, demodulation) for echo envelope detection
  • Two presets of 12-point time-varying threshold for object detection
  • Timers to measure multiple echo distance and duration
  • Integrated temperature sensor
  • Record time for object detection up to 11 m
  • 128 bytes of RAM for echo recording
  • 42 bytes of user EEPROM to store configuration for fast initialization
  • One-wire high-voltage time-command interface or USART asynchronous interface
  • CMOS level USART interface
  • Sensor diagnostics (decay frequency and time, excitation voltage), supply, and transceiver diagnostics
  • Fully integrated solution for ultrasonic sensing
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 2: –40°C to +105°C ambient operating temperature
    • Device HBM ESD classification level 2
    • Device CDM ESD classification level C4B
  • Complimentary low-side drivers with configurable current limit supporting both transformer based and direct drive topology for transducer excitation
  • Single transducer for both burst/listen or a transducer pair, one for burst and the other for listen operation
  • Low-noise receiver with programmable 6-point time-varying gain (32 to 90 dB) with DSP (BPF, demodulation) for echo envelope detection
  • Two presets of 12-point time-varying threshold for object detection
  • Timers to measure multiple echo distance and duration
  • Integrated temperature sensor
  • Record time for object detection up to 11 m
  • 128 bytes of RAM for echo recording
  • 42 bytes of user EEPROM to store configuration for fast initialization
  • One-wire high-voltage time-command interface or USART asynchronous interface
  • CMOS level USART interface
  • Sensor diagnostics (decay frequency and time, excitation voltage), supply, and transceiver diagnostics

The PGA460-Q1 device is a highly-integrated system on-chip ultrasonic transducer driver and signal conditioner with an advanced DSP core. The device has a complimentary low-side driver pair that can drive a transducer either in a transformer based topology using a step-up transformer or in a direct-drive topology using external high-side FETs. The device can receive and condition the reflected echo signal for reliable object detection. This feature is accomplished using an analog front-end (AFE) consisting of a low-noise amplifier followed by a programmable time-varying gain stage feeding into an ADC. The digitized signal is processed in the DSP core for both near-field and far-field object detection using time-varying thresholds.

The main communication with an external controller is achieved by either a time-command interface (TCI) or a one-wire USART asynchronous interface on the IO pin, or a CMOS-level USART interface on the RXD and TXD pins. The PGA460-Q1 can be put in ultra-low quiescent current low-power mode to reduce power consumption when not in use and can be woken up by commands on the communication interfaces.

The PGA460-Q1 also includes on-chip system diagnostics which monitor transducer voltage during burst, frequency and decay time of transducer to provide information about the integrity of the excitation as well as supply-side and transceiver-side diagnostics for overvoltage, undervoltage, overcurrent and short-circuit scenarios.

The PGA460-Q1 device is a highly-integrated system on-chip ultrasonic transducer driver and signal conditioner with an advanced DSP core. The device has a complimentary low-side driver pair that can drive a transducer either in a transformer based topology using a step-up transformer or in a direct-drive topology using external high-side FETs. The device can receive and condition the reflected echo signal for reliable object detection. This feature is accomplished using an analog front-end (AFE) consisting of a low-noise amplifier followed by a programmable time-varying gain stage feeding into an ADC. The digitized signal is processed in the DSP core for both near-field and far-field object detection using time-varying thresholds.

The main communication with an external controller is achieved by either a time-command interface (TCI) or a one-wire USART asynchronous interface on the IO pin, or a CMOS-level USART interface on the RXD and TXD pins. The PGA460-Q1 can be put in ultra-low quiescent current low-power mode to reduce power consumption when not in use and can be woken up by commands on the communication interfaces.

The PGA460-Q1 also includes on-chip system diagnostics which monitor transducer voltage during burst, frequency and decay time of transducer to provide information about the integrity of the excitation as well as supply-side and transceiver-side diagnostics for overvoltage, undervoltage, overcurrent and short-circuit scenarios.

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기술 자료

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19개 모두 보기
유형 직함 날짜
* Data sheet PGA460-Q1 Automotive Ultrasonic Signal Processor and Transducer Driver datasheet (Rev. C) PDF | HTML 2023/02/10
White paper Automated parking made possible with TI mmWave radar and ultrasonic sensors (Rev. B) 2023/06/23
Application note Ultrasonic Sensing Basics (Rev. D) PDF | HTML 2021/12/02
Application note PGA460 Ultrasonic Module Hardware and Software Optimization (Rev. A) PDF | HTML 2021/04/07
EVM User's guide PGA460PSM-EVM User's Guide 2019/07/15
Application brief Ultrasonic Floor-Type and Cliff Detection on Automated Vacuum Robots 2019/07/15
Application note PGA460 Array of Ultrasonic Transducers for Triangulation and Tracking 2019/07/12
Technical article Paving the way with ultrasonic sensing PDF | HTML 2019/06/10
Application note PGA460 Full-Bridge Driver Solutions for Ultrasonic Transducers (Rev. A) 2019/02/28
Design guide Ultrasonic Proximity-Sensing Module (PSM) Reference Design 2018/10/09
User guide PGA460-Q1 Ultrasonic Signal Conditioner EVM With Transducer User's Guide (Rev. B) 2018/03/19
Application brief PGA460-Q1 in Automotive Ultrasonic Kick-to-open Liftgate Systems (Rev. B) 2018/01/03
Application brief PGA460-Q1 in Ultrasonic Park Assist (UPA) (Rev. A) 2018/01/03
Technical article Where are ultrasonic sensors used? – Part 2 PDF | HTML 2017/10/31
Technical article Comparing capacitive and ultrasonic kick-to-open sensing PDF | HTML 2017/09/06
Application note PGA460 Software Development Guide (Rev. A) 2017/08/22
Technical article Where are ultrasonic sensors used? – Part 1 PDF | HTML 2017/06/29
Application note PGA460 Frequently Asked Questions (FAQ) and EVM Troubleshooting Guide 2017/05/01
User guide PGA460-Q1 EVM Quick Start Guide 2017/02/17

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

평가 보드

BOOSTXL-PGA460 — PGA460-Q1 변환기가 탑재된 초음파 센서 신호 조절기 평가 모듈

Fully evaluate the PGA460 ultrasonic sensor signal conditioner with the BOOSTXL-PGA460 (+ MSP430F5529LP). The PGA460 is an integrated ultrasonic front-end with a digital signal processor that outputs time-of-flight data, echo width and amplitude information. The driver strength is configurable by a (...)
사용 설명서: PDF
평가 보드

PGA460PSM-EVM — PGA460 초음파 근접 감지 평가 모듈

For shipments to Europe, please order the equivalent signal conditioning device BOOSTXL-PGA460

The PGA460PSM evaluation module (EVM) is a small-form-factor solution showcasing double-sided printed circuit board (PCB) spacing and the supporting component requirements for the PGA460 ultrasonic (...)

사용 설명서: PDF
TI.com에서 구매 불가
레퍼런스 디자인

TIDA-01424 — 오토모티브 초음파 킥 투 오픈(Kick to Open) 레퍼런스 디자인

This reference design uses ultrasonic sensing to detect a kicking motion indicating the user's desire to activate a power lift-gate, power trunk, or power sliding door on an automobile.  Ultrasonic sensing allows detection of more than one object, and gives a measure of distance to each (...)
Design guide: PDF
회로도: PDF
레퍼런스 디자인

TIDA-01597 — 주차 보조를 위한 차량용 초음파 감지 모듈 레퍼런스 설계

This reference design provides hardware architecture for a Park Assist System (PAS) using three highly integrated, system-on-chip (SoC) ultrasonic transducer drivers. These ultrasonic transducer drivers have an integrated signal conditioner with an advanced digital signal processor (DSP) core. (...)
Design guide: PDF
회로도: PDF
레퍼런스 디자인

TIDA-060024 — 초음파 근접 감지 모듈(PSM) 레퍼런스 설계

This reference design is a small-form factor solution showcasing double-sided PCB spacing and minimum supporting component requirements for the PGA460 ultrasonic sensor signal conditioner. This module operates in a mono-static mode for single sensor transmit and receive operation to enable object (...)
Design guide: PDF
회로도: PDF
패키지 CAD 기호, 풋프린트 및 3D 모델
TSSOP (PW) 16 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.

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