THS4061M
- High Speed
- 180 MHz Bandwidth (G = 1, –3 dB)
- 400 V/µs Slew Rate
- 40-ns Settling Time (0.1%)
- High Output Drive, IO = 115 mA (typ)
- Excellent Video Performance
- 75 MHz 0.1 dB Bandwidth (G = 1)
- 0.02% Differential Gain
- 0.02° Differential Phase
- Very Low Distortion
- THD = –72 dBc at f = 1 MHz
- Wide Range of Power Supplies
- VCC = ±5 V to ±15 V
- Available in Standard SOIC, MSOP PowerPAD™, JG, or FK Package
- Evaluation Module Available
PowerPAD is a trademark of Texas Insruments Incorporated.
The THS4061 and THS4062 are general-purpose, single/dual, high-speed voltage feed-back amplifiers ideal for a wide range of applications including video, communication, and imaging. The devices offer very good ac performance with 180-MHz bandwidth, 400-V/µs slew rate, and 40-ns settling time (0.1% ). The THS4061/2 are stable at all gains for both inverting and noninverting configurations. These amplifiers have a high output drive capability of 115 mA and draw only 7.8 mA supply current per channel. Excellent professional video results can be obtained with the low differential gain/phase errors of 0.02%/0.02° and wide 0.1 db flatness to 75 MHz. For applications requiring low distortion, the THS4061/2 is ideally suited with total harmonic distortion of 72 dBc at f = 1 MHz.
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技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | 180-MHz High-Speed Amplifiers datasheet (Rev. E) | 2003年 12月 3日 | |
* | SMD | THS4061M SMD 5962-99601 | 2016年 6月 21日 | |
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 2017年 3月 28日 | ||
Application note | Noise Analysis for High Speed Op Amps (Rev. A) | 2005年 1月 17日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
ANALOG-ENGINEER-CALC — 類比工程師計算機
VOLT-DIVIDER-CALC — Voltage divider calculation tool
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
CDIP (JG) | 8 | Ultra Librarian |
LCCC (FK) | 20 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點