THS4303
- Fixed Closed-Loop Gain Amplifier
- 10 V/V (20 dB)
- Wide Bandwidth: 1.8 GHz
- High Slew Rate: 5500 V/µs
- Low Total Input Referred Noise: 2.5 nV/Hz
- Low Distortion
- HD2: –65 dBc at 70 MHz
- HD3: –76 dBc at 70 MHz
- IMD3: –85 dBc at 100 MHz
- OIP3: 34 dBm at 100 MHz
- IMD3: –70 dBc at 300 MHz
- OIP3: 27 dBm at 300 MHz
- High Output Drive: ±180 mA
- Power Supply Voltage: 3 V or 5 V
- APPLICATIONS
- Wideband Signal Processing
- Wireless Transceivers
- IF Amplifier
- ADC Preamplifier
- DAC Output Buffers
- Test, Measurement, and Instrumentation
- Medical and Industrial Imaging
PowerPAD is a trademark of Texas Instruments.
The THS4303 device is a wideband, fixed-gain amplifier that offers high bandwidth, high slew rate, low noise, and low distortion. This combination of specifications enables analog designers to transcend current performance limitations and process analog signals at much higher speeds than previously possible with closed-loop, complementary amplifier designs. The devices are offered in a 16-pin leadless package and incorporate a powerdown mode for quiescent power savings.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | Wideband Fixed-Gain Amplifier datasheet (Rev. B) | 2005年 1月 20日 | |
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 2017年 3月 28日 | ||
Application note | Noise Analysis for High Speed Op Amps (Rev. A) | 2005年 1月 17日 |
設計與開發
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THS4303EVM — THS4303 寬頻評估模組
The THS4303 evaluation module (EVM) User's Guide is included within the THS4303 Datasheet.
The THS4303 EVM provides a platform for evaluating the THS4303 wideband, fixed-gain amplifier. The user needs only power, input signal, and test instrument to operate the EVM. The THS4303 offers high (...)
ANALOG-ENGINEER-CALC — 類比工程師計算機
VOLT-DIVIDER-CALC — Voltage divider calculation tool
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
VQFN (RGT) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點