TLC2201-SP
- QML-V Qualifed SMD 5962-9088203V2A
- Low Input Offset Voltage: 400 µV Max
- Excellent Offset Voltage Stability
With Temperature: 0.5 µV/°C Typ - Rail-to-Rail Output Swing
- Low Input Bias Current:
1 pA Typ at TA = 25°C - Common-Mode Input Voltage Range
Includes the Negative Rail - Fully Specified For Both Single-Supply and
Split-Supply Operation
LinCMOS is a trademark of Texas Instruments.
Parts, PSpice are trademarks of MicroSim Corporation.
The TLC2201 is a precision, low-noise operational amplifier using Texas Instruments Advanced LinCMOS process. This device combines the noise performance of the lowest-noise JFET amplifiers with the dc precision available previously only in bipolar amplifiers. The Advanced LinCMOS process uses silicon-gate technology to obtain input offset voltage stability with temperature and time that far exceeds that obtainable using metal-gate technology. In addition, this technology makes possible input impedance levels that meet or exceed levels offered by top-gate JFET and expensive dielectric-isolated devices.
The combination of excellent DC and noise performance with a common-mode input voltage range that includes the negative rail makes these devices an ideal choice for high-impedance, low-level signal-conditioning applications in either single-supply or split-supply configurations.
The device inputs and outputs are designed to withstand −100-mA surge currents without sustaining latch-up. In addition, internal ESD-protection circuits prevent functional failures at voltages up to 2000 V as tested under MIL-PRF-38535, Method 3015.2; however, care should be exercised in handling these devices as exposure to ESD may result in degradation of the parametric performance.
The TLC2201 is characterized for operation over the full military temperature range of −55°C to 125°C.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TLC2201-SP Class-V Advanced LinCMOS Low-Noise Precision Operational Amp datasheet | 2011年 2月 11日 |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點