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TLC2252-DIE

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產品規格表

TLC2252-DIE

現行
產品規格表 立即訂購

產品詳細資料

Number of channels 2 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 16 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 4.4 Rail-to-rail In to V-, Out GBW (typ) (MHz) 0.2 Slew rate (typ) (V/µs) 0.12 Vos (offset voltage at 25°C) (max) (mV) 1.5 Iq per channel (typ) (mA) 0.035 Vn at 1 kHz (typ) (nV√Hz) 19 Rating Military Operating temperature range (°C) 0 to 0 Offset drift (typ) (µV/°C) 0.5 Features High Cload Drive Input bias current (max) (pA) 60 CMRR (typ) (dB) 83 Iout (typ) (A) 0.008 Architecture CMOS Input common mode headroom (to negative supply) (typ) (V) -0.3 Input common mode headroom (to positive supply) (typ) (V) -0.8 Output swing headroom (to negative supply) (typ) (V) 0.01 Output swing headroom (to positive supply) (typ) (V) -0.06
Number of channels 2 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 16 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 4.4 Rail-to-rail In to V-, Out GBW (typ) (MHz) 0.2 Slew rate (typ) (V/µs) 0.12 Vos (offset voltage at 25°C) (max) (mV) 1.5 Iq per channel (typ) (mA) 0.035 Vn at 1 kHz (typ) (nV√Hz) 19 Rating Military Operating temperature range (°C) 0 to 0 Offset drift (typ) (µV/°C) 0.5 Features High Cload Drive Input bias current (max) (pA) 60 CMRR (typ) (dB) 83 Iout (typ) (A) 0.008 Architecture CMOS Input common mode headroom (to negative supply) (typ) (V) -0.3 Input common mode headroom (to positive supply) (typ) (V) -0.8 Output swing headroom (to negative supply) (typ) (V) 0.01 Output swing headroom (to positive supply) (typ) (V) -0.06
DIESALE (TD) — See data sheet
  • Output Swing Includes Both Supply Rails
  • Low Noise
  • Low Input Bias Current
  • Fully Specified for Both Single-Supply and Split-Supply Operation
  • Very Low Power
  • Common-Mode Input Voltage Range Includes Negative Rail
  • Low Input Offset Voltage
  • Macromodel Included
  • Output Swing Includes Both Supply Rails
  • Low Noise
  • Low Input Bias Current
  • Fully Specified for Both Single-Supply and Split-Supply Operation
  • Very Low Power
  • Common-Mode Input Voltage Range Includes Negative Rail
  • Low Input Offset Voltage
  • Macromodel Included

The TLC2252 is a dual and quadruple operational amplifier from Texas Instruments. The device exhibits rail-to-rail output performance for increased dynamic range in single- or split-supply applications. The micropower operation makes it a good choice for battery-powered applications. The noise performance has been dramatically improved over previous generations of CMOS amplifiers.

The TLC2252 amplifier, exhibiting high input impedance and low noise, is excellent for small-signal conditioning for high-impedance sources, such as piezoelectric transducers. Because of the micropower dissipation levels, this device works well in hand-held monitoring and remote-sensing applications. In addition, the rail-to-rail output feature with single or split supplies makes this device a great choice when interfacing with analog-to-digital converters (ADCs).

The TLC2252 is a dual and quadruple operational amplifier from Texas Instruments. The device exhibits rail-to-rail output performance for increased dynamic range in single- or split-supply applications. The micropower operation makes it a good choice for battery-powered applications. The noise performance has been dramatically improved over previous generations of CMOS amplifiers.

The TLC2252 amplifier, exhibiting high input impedance and low noise, is excellent for small-signal conditioning for high-impedance sources, such as piezoelectric transducers. Because of the micropower dissipation levels, this device works well in hand-held monitoring and remote-sensing applications. In addition, the rail-to-rail output feature with single or split supplies makes this device a great choice when interfacing with analog-to-digital converters (ADCs).
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類型 標題 日期
* Data sheet Advanced LinCMOS Rail-to-Rail Very Low-Power Operational Amplifier datasheet 2013年 1月 3日

訂購與品質

內含資訊：
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊：
  • 晶圓廠位置
  • 組裝地點

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