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TLC2274-HT
- Qualified for Automotive Applications
- Qualified in Accordance With AEC-Q100
- Output Swing Includes Both Supply Rails
- Low Noise: 9 nV/√Hz Typ at ƒ = 1 kHz
- Low Input Bias Current: 1 pA Typical
- Fully Specified for Both Single-Supply
and Split-Supply
Operation - Common-Mode Input Voltage Range Includes
Negative Rail - High-Gain Bandwidth: 2.2 MHz Typical
- High Slew Rate: 3.6 V/µs Typical
- Low Input Offset Voltage 2500-µV Max
at TA = 25°C - Macromodel Included
The TLC2274 is a quadruple operational amplifier from Texas Instruments. The device exhibits rail-to-rail output performance for increased dynamic range in single- or split-supply applications. The TLC2274 offers 2 MHz of bandwidth and 3 V/µs of slew rate for higher speed applications. These device offers comparable ac performance while having better noise, input offset voltage, and power dissipation than existing CMOS operational amplifiers. The TLC2274 has a noise voltage of 9nV/√Hz, two times lower than competitive solutions.
The TLC2274, exhibiting high input impedance and low noise, is excellent for small-signal conditioning for high-impedance sources, such as piezoelectric transducers. Because of the micropower dissipation levels, this device works well in hand-held monitoring and remote-sensing applications. In addition, the rail-to-rail output feature, with single- or split-supplies, makes this device a great choice when interfacing with analog-to-digital converters (ADCs). This family is fully characterized at 5 V and ±5 V.
It offers increased output dynamic range, lower noise voltage, and lower input offset voltage. This enhanced feature set allows the device to be used in a wider range of applications.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TLC2274-HT Advanced LinCMOS™ Rail-to-Rail Operational Amplifier datasheet | PDF | HTML | 2014年 1月 13日 |
E-book | Analog Engineer’s Pocket Reference Guide Fifth Edition (Rev. C) | 2018年 11月 30日 | ||
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 2017年 3月 28日 |
設計與開發
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---|---|---|
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訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點