TLV2455A
- Supply Current...23 µA/Channel
- Gain-Bandwidth Product...220 kHz
- Output Drive Capability...±10 mA
- Input Offset Voltage...20 µV (typ)
- VDD Range...2.7 V to 6 V
- Power Supply Rejection Ratio...106 dB
- Ultralow-Power Shutdown Mode
IDD ...16 nA/ch - Rail-To-Rail Input/Output (RRIO)
- Ultrasmall Packaging
- 5 or 6 Pin SOT-23 (TLV2450/1)
- 8 or 10 Pin MSOP (TLV2452/3)
The TLV245x is a family of rail-to-rail input/output operational amplifiers that sets a new performance point for supply current and ac performance. These devices consume a mere 23 µA/channel while offering 220 kHz of gain-bandwidth product, much higher than competitive devices with similar supply current levels. Along with increased ac performance, the amplifier provides high output drive capability, solving a major shortcoming of older micropower rail-to-rail input/output operational amplifiers. The TLV245x can swing to within 250 mV of each supply rail while driving a 2.5-mA load. Both the inputs and outputs swing rail-to-rail for increased dynamic range in low-voltage applications. This performance makes the TLV245x family ideal for portable medical equipment, patient monitoring systems, and data acquisition circuits.
Three members of the family (TLV2450/3/5) offer a shutdown terminal for conserving battery life in portable applications. During shutdown, the outputs are placed in a high-impedance state and the amplifier consumes only 16 nA/channel. The family is fully specified at 3 V and 5 V across an expanded industrial temperature range (40°C to 125°C). The singles and duals are available in the SOT23 and MSOP packages, while the quads are available in TSSOP. The TLV2450 offers an amplifier with shutdown functionality all in a 6-pin SOT23 package, making it perfect for high density circuits.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TLV245x, TLV245xA: 23-uA 220-KHz Rail-to-Rail Input/Output Op Amps With Shutdown datasheet (Rev. F) | 2005年 1月 19日 |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點