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TLV4113-EP

現行

具備關機功能的強化型產品雙路高輸出驅動運算放大器

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產品規格表

TLV4113-EP

現行
產品規格表 立即訂購

產品詳細資料

Number of channels 2 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 2.5 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 6 Iout (typ) (A) 0.32 GBW (typ) (MHz) 2.7 Slew rate (typ) (V/µs) 1.57 Vos (offset voltage at 25°C) (max) (mV) 3.5 Offset drift (typ) (V/°C) 0.000003 Iq per channel (typ) (mA) 0.7 Features Shutdown Rating HiRel Enhanced Product Operating temperature range (°C) -55 to 125 Input bias current (max) (pA) 25 CMRR (typ) (dB) 68 Rail-to-rail In to V-, Out Architecture CMOS
Number of channels 2 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 2.5 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 6 Iout (typ) (A) 0.32 GBW (typ) (MHz) 2.7 Slew rate (typ) (V/µs) 1.57 Vos (offset voltage at 25°C) (max) (mV) 3.5 Offset drift (typ) (V/°C) 0.000003 Iq per channel (typ) (mA) 0.7 Features Shutdown Rating HiRel Enhanced Product Operating temperature range (°C) -55 to 125 Input bias current (max) (pA) 25 CMRR (typ) (dB) 68 Rail-to-rail In to V-, Out Architecture CMOS
  • Controlled Baseline
    • One Assembly Site
    • One Test Site
    • One Fabrication Site
  • Extended Temperature Performance of -55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree(1)
  • High Output Drive . . . >300 mA
  • Rail-To-Rail Output
  • Unity-Gain Bandwidth . . . 2.7 MHz
  • Slew Rate . . . 1.5 V/µs
  • Supply Current . . . 700 µA/Per Channel
  • Supply Voltage Range . . . 2.5 V to 6 V
  • Universal Op Amp EVM

(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

PowerPAD is a trademark of Texas Instruments.
3Parts, Microsim PSpice are trademarks of MicroSim Corporation.
  • Controlled Baseline
    • One Assembly Site
    • One Test Site
    • One Fabrication Site
  • Extended Temperature Performance of -55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree(1)
  • High Output Drive . . . >300 mA
  • Rail-To-Rail Output
  • Unity-Gain Bandwidth . . . 2.7 MHz
  • Slew Rate . . . 1.5 V/µs
  • Supply Current . . . 700 µA/Per Channel
  • Supply Voltage Range . . . 2.5 V to 6 V
  • Universal Op Amp EVM

(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

PowerPAD is a trademark of Texas Instruments.
3Parts, Microsim PSpice are trademarks of MicroSim Corporation.

The TLV411x single supply operational amplifiers provide output currents in excess of 300 mA at 5 V. This enables standard pin-out amplifiers to be used as high current buffers or in coil driver applications. The TLV4110 and TLV4113 come with a shutdown feature.

The TLV411x is available in the ultra-small MSOP PowerPAD package, which offers the exceptional thermal impedance required for amplifiers delivering high current levels.

All TLV411x devices are offered in SOIC (single and dual) and MSOP PowerPAD (dual).

The TLV411x single supply operational amplifiers provide output currents in excess of 300 mA at 5 V. This enables standard pin-out amplifiers to be used as high current buffers or in coil driver applications. The TLV4110 and TLV4113 come with a shutdown feature.

The TLV411x is available in the ultra-small MSOP PowerPAD package, which offers the exceptional thermal impedance required for amplifiers delivering high current levels.

All TLV411x devices are offered in SOIC (single and dual) and MSOP PowerPAD (dual).
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類型 標題 日期
* Data sheet High-Output-Drive Operational Amplifier With Shutdown datasheet (Rev. D) 2008年 5月 6日

訂購與品質

內含資訊：
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊：
  • 晶圓廠位置
  • 組裝地點

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