TLV7011
- Ultra-small packages: X2SON (0.8 × 0.8 mm2) , WSON (2 × 2 mm2)
- Standard packages: SOT23, SC70, VSSOP
- Wide supply voltage range of 1.6 V to 6.5 V
- Quiescent supply current of 5 µA
- Low propagation delay of 260 ns
- Rail-to-rail common-mode input voltage
- Internal hysteresis
- Push-pull and open-drain output options
- No phase reversal for over driven inputs
- –40°C to 125°C Operating ambient temperature
The TLV7011/7021 (single-channel) and TLV7012/7022 (dual-channel) are micro-power comparators that feature low-voltage operation with rail-to-rail input capability. These comparators are available in an ultra-small, leadless package measuring 0.8 mm × 0.8 mm and standard leaded packages, making them applicable for space-critical designs like smartphones and other portable or battery-powered applications.
The TLV701x and TLV702x offer an excellent speed-to-power combination with a propagation delay of 260 ns and a quiescent supply current of 5 µA. This combination of fast response time at micropower enables power conscious systems to monitor and respond quickly to fault conditions. With an operating voltage range of 1.6 V to 6.5 V, these comparators are compatible with 3-V and 5-V systems.
These comparators also feature no output phase inversion with overdriven inputs and internal hysteresis. These features make this family of comparators well suited for precision voltage monitoring in harsh, noisy environments where slow-moving input signals must be converted into clean digital outputs.
The TLV701x have push-pull output stages capable of sinking and sourcing milliamps of current when controlling an LED or driving a capacitive load. The TLV702x have open-drain output stages that can be pulled beyond VCC, making it appropriate for level translators and bipolar to single-ended converters.
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設計與開發
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封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOT-23 (DBV) | 5 | Ultra Librarian |
SOT-SC70 (DCK) | 5 | Ultra Librarian |
X2SON (DPW) | 5 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。