TMP100-Q1
- AEC-Q100 qualified with the following results:
- Temperature grade 1: −55°C to +125°C operating temperature range
- HBM ESD component classification level 2
- CDM ESD component classification level C5
- Functional Safety-Capable
- Digital output: SMBus™, two-wire, and I2C interface compatibility
- Resolution: 9 to 12 bits, user-selectable
- Accuracy:
- ±1°C (typical) from –55°C to 125°C
- ±2°C (maximum) from –55°C to 125°C
- Low quiescent current: 45-µA, 0.1-µA standby
- Wide supply range: 2.7 V to 5.5 V
- TMP100-Q1 features two address pins
- TMP101-Q1 features one address pin and an ALERT pin
- 6-pin SOT-23 package
The TMP100-Q1 and TMP101-Q1 devices are digital temperature sensors designed for negative temperature coefficient (NTC) and positive temperature coefficient (PTC) thermistor replacement. The devices offer a typical accuracy of ±1°C without requiring calibration or external component signal conditioning. Device temperature sensors are highly linear and do not require complex calculations or look-up tables to derive the temperature. The on-chip, 12-bit ADC offers resolutions down to 0.0625°C. The devices are available in 6-Pin SOT-23 packages.
The TMP100-Q1 and TMP101-Q1 devices feature SMBus, Two-Wire, and I2C interface compatibility. The TMP100-Q1 device allows up to eight devices on one bus. The TMP101-Q1 device offers an SMBus Alert function with up to three devices per bus.
The TMP100-Q1 and TMP101-Q1 devices are designed for extended temperature measurement in a variety of communication, computer, consumer, environmental, industrial, and instrumentation applications.
The TMP100-Q1 and TMP101-Q1 devices are specified for operation over a temperature range of −55°C to 125°C.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TMP100-Q1 and TMP101-Q1 Temperature Sensor With I2C and SMBus Interface with Alert Function in SOT-23 Package datasheet (Rev. B) | PDF | HTML | 2022年 6月 17日 |
Functional safety information | TMP100-Q1 Functional Safety FIT Rate and FMD | PDF | HTML | 2022年 6月 17日 | |
Technical article | How to maximize powertrain efficiency and reliability with high-accuracy temperatu | PDF | HTML | 2021年 5月 10日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOT-23 (DBV) | 6 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點