TMP121-EP
- Controlled Baseline
- One Assembly/Test Site, One Fabrication Site
- Extended Temperature Performance of -40°C to 125°C
- Enhanced Diminishing Manufacturing Sources (DMS) Support
- Enhanced Product-Change Notification
- Qualification Pedigree
- Digital Output: SPI-Compatible Interface
- Resolution: 12-Bit + Sign, 0.0625°C
- Accuracy: ±1.5°C from -25°C to 85°C (max)
- Low Quiescent Current: 50 µA (max)
- Wide Supply Range: 2.7 V to 5.5 V
- Tiny SOT23-6 Package
- Operation to 150°C
- APPLICATIONS
- Power-Supply Temperature Monitoring
- Computer Peripheral Thermal Protection
- Notebook Computers
- Battery Management
- Environmental Monitoring
(1)Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified
performance and environmental limits.
SPI is a trademark of Texas Instruments.
The TMP121 and TMP123 are SPI-compatible temperature sensors available in the tiny SOT23-6 package. Requiring no external components, the TMP121 and TMP123 are capable of measuring temperatures within 2°C of accuracy over a temperature range of -40°C to 125°C. Low supply current and a supply range from 2.7 V to 5.5 V make the TMP121 and TMP123 excellent candidates for low-power applications.
The TMP121 and TMP123 are ideal for extended thermal measurement in a variety of communication, computer, consumer, environmental, industrial, and instrumentation applications.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | 1.5 Degrees C Accurate Digital Temperature Sensor w/SPI Interface datasheet | 2005年 9月 22日 | |
* | VID | TMP121-EP VID V6206608 | 2016年 6月 21日 | |
* | Radiation & reliability report | TMP121AQDBVREP Reliability Report | 2012年 11月 6日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOT-23 (DBV) | 6 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點