SLYU067 December   2023 DRV5011 , DRV5012 , DRV5013 , DRV5013-Q1 , DRV5015 , DRV5015-Q1 , DRV5021 , DRV5021-Q1 , DRV5023 , DRV5023-Q1 , DRV5032 , DRV5033 , DRV5033-Q1 , DRV5053 , DRV5053-Q1 , DRV5055 , DRV5055-Q1 , DRV5056 , DRV5056-Q1 , DRV5057 , DRV5057-Q1 , TMAG3001 , TMAG5110 , TMAG5110-Q1 , TMAG5111 , TMAG5111-Q1 , TMAG5115 , TMAG5123 , TMAG5123-Q1 , TMAG5124 , TMAG5124-Q1 , TMAG5131-Q1 , TMAG5170 , TMAG5170-Q1 , TMAG5170D-Q1 , TMAG5173-Q1 , TMAG5231 , TMAG5253 , TMAG5273 , TMAG6180-Q1 , TMAG6181-Q1 , TMCS1107 , TMCS1108

 

  1.   1
  2.   Trademarks
  3.   Abstract
  4. 1Introduction and Features Overview
    1. 1.1 Simulating Magnetic Fields Tool Introduction
  5. 2Simulation Interface
    1. 2.1 Getting Started
    2. 2.2 Creating a New Design
    3. 2.3 Selecting a Sensor
    4. 2.4 Sensor Output Types
  6. 3Simulation Environment
  7. 4Simulation Inputs
    1. 4.1 Magnet Input Fields
      1. 4.1.1 Magnet Specifications
      2. 4.1.2 Magnet Geometry
      3. 4.1.3 Magnet Motion
      4. 4.1.4 Magnet Rotation
      5. 4.1.5 Hinge Magnet Motion
      6. 4.1.6 Linear Magnet Motion
      7. 4.1.7 Joystick Magnet Motion
    2. 4.2 Sensor Input Fields
      1. 4.2.1 Linear Sensor Format
      2. 4.2.2 Latch and Switch Format
      3. 4.2.3 Sensor Position
    3. 4.3 Simulation Settings
  8. 5Simulation Results
  9. 6Parametric Sweeps
  10. 7Comparing Designs
  11. 8Summary
  12. 9References
  13.   A Appendix
    1.     A.1 Sensor Placement
    2.     A.2 Magnet Materials
    3.     A.3 Rotation Tips

Linear Magnet Motion

GUID-20231114-SS0I-S24D-CBV1-DXQXM11TKTBR-low.svgFigure 4-6 Linear Motion Fields

For help understanding magnet orientation and rotation within the simulation environment please refer to Section A.3.

Linear travel requires that both the start and final coordinates are entered. Motion steps the position of the magnet evenly from the start to finish position. TI recommends choosing a value that is a factor of the total distance traveled when setting the step size. Step size can be set as described in Section 4.3.