SLYU067 December   2023 DRV5011 , DRV5012 , DRV5013 , DRV5013-Q1 , DRV5015 , DRV5015-Q1 , DRV5021 , DRV5021-Q1 , DRV5023 , DRV5023-Q1 , DRV5032 , DRV5033 , DRV5033-Q1 , DRV5053 , DRV5053-Q1 , DRV5055 , DRV5055-Q1 , DRV5056 , DRV5056-Q1 , DRV5057 , DRV5057-Q1 , TMAG3001 , TMAG5110 , TMAG5110-Q1 , TMAG5111 , TMAG5111-Q1 , TMAG5115 , TMAG5123 , TMAG5123-Q1 , TMAG5124 , TMAG5124-Q1 , TMAG5131-Q1 , TMAG5170 , TMAG5170-Q1 , TMAG5170D-Q1 , TMAG5173-Q1 , TMAG5231 , TMAG5253 , TMAG5273 , TMAG6180-Q1 , TMAG6181-Q1 , TMCS1107 , TMCS1108

 

  1.   1
  2.   Trademarks
  3.   Abstract
  4. 1Introduction and Features Overview
    1. 1.1 Simulating Magnetic Fields Tool Introduction
  5. 2Simulation Interface
    1. 2.1 Getting Started
    2. 2.2 Creating a New Design
    3. 2.3 Selecting a Sensor
    4. 2.4 Sensor Output Types
  6. 3Simulation Environment
  7. 4Simulation Inputs
    1. 4.1 Magnet Input Fields
      1. 4.1.1 Magnet Specifications
      2. 4.1.2 Magnet Geometry
      3. 4.1.3 Magnet Motion
      4. 4.1.4 Magnet Rotation
      5. 4.1.5 Hinge Magnet Motion
      6. 4.1.6 Linear Magnet Motion
      7. 4.1.7 Joystick Magnet Motion
    2. 4.2 Sensor Input Fields
      1. 4.2.1 Linear Sensor Format
      2. 4.2.2 Latch and Switch Format
      3. 4.2.3 Sensor Position
    3. 4.3 Simulation Settings
  8. 5Simulation Results
  9. 6Parametric Sweeps
  10. 7Comparing Designs
  11. 8Summary
  12. 9References
  13.   A Appendix
    1.     A.1 Sensor Placement
    2.     A.2 Magnet Materials
    3.     A.3 Rotation Tips

4.2.3 Sensor Position

The final sensor inputs relate to the orientation of the sensor package within the simulation and the physical placement. The sensor response corresponds to the sensitivity direction and rotating the package within the simulation environment to achieve the desired response.

GUID-20231114-SS0I-XBLX-8MNW-BCFZ9MS5ZD9R-low.svg Figure 4-13 Sensor Position Inputs

This rotation coordinates with the sensor reference and not the global origin, similar to the magnet. The sensor reference point is typically the center of the package footprint seen on the surface of the PCB. More details for each package are available in Section A.1.

For help understanding sensor orientation and rotation within the simulation environment please refer to Section A.3.