Startseite Schnittstelle LVDS-, M-LVDS- und PECL-ICs
Startseite
Schnittstelle
LVDS-, M-LVDS- und PECL-ICs

SN55LVDS32

AKTIV

Vierfach-LVDS-Empfänger

Jetzt bestellen
Datenblatt

SN55LVDS32

AKTIV
Datenblatt Jetzt bestellen

Produktdetails

Function Receiver Protocols LVDS Number of transmitters 0 Number of receivers 4 Supply voltage (V) 3.3 Signaling rate (Mbps) 100 Input signal LVDS Output signal LVTTL Rating Military Operating temperature range (°C) -55 to 125
Function Receiver Protocols LVDS Number of transmitters 0 Number of receivers 4 Supply voltage (V) 3.3 Signaling rate (Mbps) 100 Input signal LVDS Output signal LVTTL Rating Military Operating temperature range (°C) -55 to 125
CDIP (J) 16 135.3552 mm² 19.56 x 6.92 CFP (W) 16 69.319 mm² 10.3 x 6.73 LCCC (FK) 20 79.0321 mm² 8.89 x 8.89
  • Meet or Exceed the Requirements of ANSI
    TIA/EIA-644 Standard
  • Operate With a Single 3.3-V Supply
  • Designed for Signaling Rates of up to
    150 Mbps
  • Differential Input Thresholds ±100 mV Max
  • Typical Propagation Delay Time of 2.1 ns
  • Power Dissipation 60 mW Typical Per
    Receiver at Maximum Data Rate
  • Bus-Terminal ESD Protection Exceeds 8 kV
  • Low-Voltage TTL (LVTTL) Logic Output
    Levels
  • Pin Compatible With AM26LS32, MC3486,
    and µA9637
  • Open-Circuit Fail-Safe
  • Cold Sparing for Space and High-Reliability
    Applications Requiring Redundancy
  • Meet or Exceed the Requirements of ANSI
    TIA/EIA-644 Standard
  • Operate With a Single 3.3-V Supply
  • Designed for Signaling Rates of up to
    150 Mbps
  • Differential Input Thresholds ±100 mV Max
  • Typical Propagation Delay Time of 2.1 ns
  • Power Dissipation 60 mW Typical Per
    Receiver at Maximum Data Rate
  • Bus-Terminal ESD Protection Exceeds 8 kV
  • Low-Voltage TTL (LVTTL) Logic Output
    Levels
  • Pin Compatible With AM26LS32, MC3486,
    and µA9637
  • Open-Circuit Fail-Safe
  • Cold Sparing for Space and High-Reliability
    Applications Requiring Redundancy

The SN55LVDS32, SN65LVDS32, SN65LVDS3486, and SN65LVDS9637 devices are differential line receivers that implement the electrical characteristics of low-voltage differential signaling (LVDS). This signaling technique lowers the output voltage levels of 5-V differential standard levels (such as EIA/TIA-422B) to reduce the power, increase the switching speeds, and allow operation with a 3.3-V supply rail. Any of the differential receivers provides a valid logical output state with a ±100-mV differential input voltage within the input common-mode voltage range. The input common-mode voltage range allows 1 V of ground potential difference between two LVDS nodes.

The intended application of these devices and signaling technique is both point-to-point and multidrop (one driver and multiple receivers) data transmission over controlled impedance media of approximately 100 Ω. The transmission media may be printed-circuit board traces, backplanes, or cables. The ultimate rate and distance of data transfer depends on the attenuation characteristics of the media and the noise coupling to the environment.

The SN65LVDS32, SN65LVDS3486, and SN65LVDS9637 devices are characterized for operation from –40°C to 85°C. The SN55LVDS32 device is characterized for operation from –55°C to 125°C.

The SN55LVDS32, SN65LVDS32, SN65LVDS3486, and SN65LVDS9637 devices are differential line receivers that implement the electrical characteristics of low-voltage differential signaling (LVDS). This signaling technique lowers the output voltage levels of 5-V differential standard levels (such as EIA/TIA-422B) to reduce the power, increase the switching speeds, and allow operation with a 3.3-V supply rail. Any of the differential receivers provides a valid logical output state with a ±100-mV differential input voltage within the input common-mode voltage range. The input common-mode voltage range allows 1 V of ground potential difference between two LVDS nodes.

The intended application of these devices and signaling technique is both point-to-point and multidrop (one driver and multiple receivers) data transmission over controlled impedance media of approximately 100 Ω. The transmission media may be printed-circuit board traces, backplanes, or cables. The ultimate rate and distance of data transfer depends on the attenuation characteristics of the media and the noise coupling to the environment.

The SN65LVDS32, SN65LVDS3486, and SN65LVDS9637 devices are characterized for operation from –40°C to 85°C. The SN55LVDS32 device is characterized for operation from –55°C to 125°C.
filter Andere LVDS-, M-LVDS- und PECL-ICs suchen
Herunterladen Video mit Transkript ansehen Video

Technische Dokumentation

star =Von TI ausgewählte Top-Empfehlungen für dieses Produkt
Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.
Alle anzeigen 3
Typ Titel Datum
* Data sheet SNx5LVDS32, SN65LVDS3486, SN65LVDS9637 High-Speed Differential Line Receivers datasheet (Rev. R) 06 Aug 2014
* SMD SN55LVDS32 SMD 5962-97622 21 Jun 2016
More literature Quad High-Speed LVDS Differential Drivers And Receivers 25 Jan 1999

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Simulationstool

PSPICE-FOR-TI — PSpice® für TI Design-und Simulationstool

PSpice® für TI ist eine Design- und Simulationsumgebung, welche Sie dabei unterstützt, die Funktionalität analoger Schaltungen zu evaluieren. Diese voll ausgestattete Design- und Simulationssuite verwendet eine analoge Analyse-Engine von Cadence®. PSpice für TI ist kostenlos erhältlich und (...)
Anfordern
Simulationstool

TINA-TI — SPICE-basiertes analoges Simulationsprogramm

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
Benutzerhandbuch: PDF
View Options
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
CDIP (J) 16 Ultra Librarian
CFP (W) 16 Ultra Librarian
LCCC (FK) 20 Ultra Librarian
Es gelten die allgemeinen Geschäftsbedingungen von TI für Evaluierungsartikel.

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

Empfohlene Produkte können Parameter, Evaluierungsmodule oder Referenzdesigns zu diesem TI-Produkt beinhalten.

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Alle Forenthemen auf Englisch anzeigen

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

Videos