SN74LVC1T45

AKTIV

1-Bit-Dual-Supply-Bus-Transceiver mit konfigurierbarer Spannungsumsetzung und Tri-State-Ausgängen

Produktdetails

Technology family LVC Applications GPIO Bits (#) 1 High input voltage (min) (V) 1.08 High input voltage (max) (V) 5.5 Vout (min) (V) 1.65 Vout (max) (V) 5.5 Data rate (max) (Mbps) 300 IOH (max) (mA) -32 IOL (max) (mA) 32 Supply current (max) (µA) 4 Features Overvoltage tolerant inputs, Partial power down (Ioff), Vcc isolation Input type Standard CMOS Output type Balanced CMOS, Push-Pull Rating Catalog Operating temperature range (°C) -40 to 85
Technology family LVC Applications GPIO Bits (#) 1 High input voltage (min) (V) 1.08 High input voltage (max) (V) 5.5 Vout (min) (V) 1.65 Vout (max) (V) 5.5 Data rate (max) (Mbps) 300 IOH (max) (mA) -32 IOL (max) (mA) 32 Supply current (max) (µA) 4 Features Overvoltage tolerant inputs, Partial power down (Ioff), Vcc isolation Input type Standard CMOS Output type Balanced CMOS, Push-Pull Rating Catalog Operating temperature range (°C) -40 to 85
DSBGA (YZP) 6 2.1875 mm² 1.75 x 1.25 SOT-23 (DBV) 6 8.12 mm² 2.9 x 2.8 SOT-5X3 (DRL) 6 2.56 mm² 1.6 x 1.6 SOT-SC70 (DCK) 6 4.2 mm² 2 x 2.1 USON (DPK) 6 2.56 mm² 1.6 x 1.6
  • ESD protection exceeds JESD 22:
    • 2000V Human-Body Model (A114-A)
    • 200V Machine Model (A115-A)
    • 1000V Charged-Device Model (C101)
  • Available in the Texas Instruments NanoFree™ package
  • Fully configurable dual-rail design allows each port to operate over the full 1.65V to 5.5V power-supply range
  • VCC isolation feature – if either VCC input is at GND, both ports are in the high-impedance state
  • DIR input circuit referenced to VCCA
  • Low power consumption, 4µA maximum ICC
  • ±24mA output drive at 3.3V
  • Ioff supports partial-power-down mode operation
  • Maximum data rates
    • 420Mbps (3.3V to 5V translation)
    • 210Mbps (translate to 3.3V)
    • 140Mbps (translate to 2.5V)
    • 75Mbps (translate to 1.8V)
  • Latch-up performance exceeds 100mA per JESD 78, Class II
  • ESD protection exceeds JESD 22:
    • 2000V Human-Body Model (A114-A)
    • 200V Machine Model (A115-A)
    • 1000V Charged-Device Model (C101)
  • Available in the Texas Instruments NanoFree™ package
  • Fully configurable dual-rail design allows each port to operate over the full 1.65V to 5.5V power-supply range
  • VCC isolation feature – if either VCC input is at GND, both ports are in the high-impedance state
  • DIR input circuit referenced to VCCA
  • Low power consumption, 4µA maximum ICC
  • ±24mA output drive at 3.3V
  • Ioff supports partial-power-down mode operation
  • Maximum data rates
    • 420Mbps (3.3V to 5V translation)
    • 210Mbps (translate to 3.3V)
    • 140Mbps (translate to 2.5V)
    • 75Mbps (translate to 1.8V)
  • Latch-up performance exceeds 100mA per JESD 78, Class II

This single-bit noninverting bus transceiver uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.65V to 5.5V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 1.65V to 5.5V. This allows for universal low-voltage bidirectional translation between any of the 1.8V, 2.5V, 3.3V, and 5V voltage nodes.

The SN74LVC1T45 is designed for asynchronous communication between two data buses. The logic levels of the direction-control (DIR) input activate either the B-port outputs or the A-port outputs. The device transmits data from the A bus to the B bus when the B-port outputs are activated and from the B bus to the A bus when the A-port outputs are activated. The input circuitry is always active on both A and B ports and must have a logic HIGH or LOW level applied to prevent excess ICC and ICCZ.

The SN74LVC1T45 is designed so that the DIR input is powered by VCCA. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The VCC isolation feature is designed so that if either VCC input is at GND, then both ports are in the high-impedance state.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This single-bit noninverting bus transceiver uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.65V to 5.5V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 1.65V to 5.5V. This allows for universal low-voltage bidirectional translation between any of the 1.8V, 2.5V, 3.3V, and 5V voltage nodes.

The SN74LVC1T45 is designed for asynchronous communication between two data buses. The logic levels of the direction-control (DIR) input activate either the B-port outputs or the A-port outputs. The device transmits data from the A bus to the B bus when the B-port outputs are activated and from the B bus to the A bus when the A-port outputs are activated. The input circuitry is always active on both A and B ports and must have a logic HIGH or LOW level applied to prevent excess ICC and ICCZ.

The SN74LVC1T45 is designed so that the DIR input is powered by VCCA. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The VCC isolation feature is designed so that if either VCC input is at GND, then both ports are in the high-impedance state.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

Herunterladen Video mit Transkript ansehen Video

Ähnliche Produkte, die für Sie interessant sein könnten

Gleiche Funktionalität, gleiche Pinbelegung wie verglichener Baustein
TXU0102 AKTIV Zweikanal-Pegelumsetzer mit festgelegter Richtung mit allen Kanälen in derselben Richtung 2 channel fixed direction level translator
TXU0202 AKTIV Zweikanal-Pegelumsetzer mit festgelegter Richtung mit Kanälen in entgegengesetzter Richtung 2 channel fixed direction level translator

Technische Dokumentation

star =Von TI ausgewählte Top-Empfehlungen für dieses Produkt
Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.
Alle anzeigen 31
Typ Titel Datum
* Data sheet SN74LVC1T45 Single-Bit Dual-Supply Bus Transceiver With Configurable Voltage Translation and 3-State Outputs datasheet (Rev. N) PDF | HTML 24 Jun 2024
Application note Understanding Transient Drive Strength vs. DC Drive Strength in CMOS Output Buffers PDF | HTML 14 Mai 2024
White paper Understanding Functional Safety FIT Base Failure Rate Estimates per IEC 62380 and SN 29500 (Rev. A) PDF | HTML 30 Apr 2024
EVM User's guide Generic AVC and LVC Direction Controlled Translation EVM (Rev. B) 30 Jul 2021
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Selection guide Voltage Translation Buying Guide (Rev. A) 15 Apr 2021
Selection guide Little Logic Guide 2018 (Rev. G) 06 Jul 2018
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note How to Select Little Logic (Rev. A) 26 Jul 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dez 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Product overview Design Summary for WCSP Little Logic (Rev. B) 04 Nov 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
User guide Signal Switch Data Book (Rev. A) 14 Nov 2003
Application note Use of the CMOS Unbuffered Inverter in Oscillator Circuits 06 Nov 2003
User guide LVC and LV Low-Voltage CMOS Logic Data Book (Rev. B) 18 Dez 2002
Application note Texas Instruments Little Logic Application Report 01 Nov 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards 13 Jun 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 22 Mai 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 10 Mai 2002
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS 27 Mär 2002
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 01 Dez 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 Aug 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 Jun 1997
Application note LVC Characterization Information 01 Dez 1996
Application note Input and Output Characteristics of Digital Integrated Circuits 01 Okt 1996
Application note Live Insertion 01 Okt 1996
Design guide Low-Voltage Logic (LVC) Designer's Guide 01 Sep 1996
Application note Understanding Advanced Bus-Interface Products Design Guide 01 Mai 1996

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Evaluierungsplatine

5-8-LOGIC-EVM — Generisches Logik-Evaluierungsmodul für 5- bis 8-polige DCK-, DCT-, DCU-, DRL- und DBV-Gehäuse

Flexibles EVM zur Unterstützung aller Geräte mit 5- bis 8-poligem DCK-, DCT-, DCU-, DRL- oder DBV-Gehäuse.
Benutzerhandbuch: PDF
Evaluierungsplatine

AVCLVCDIRCNTRL-EVM — Generisches EVM für richtungsgesteuerte bidirektionale Umsetzungsgeräte mit Unterstützung für AVC un

The generic EVM is designed to support one, two, four and eight channel LVC and AVC direction-controlled translation devices. It also supports the bus hold and automotive -Q1 devices in the same number of channels. The AVC are low voltage translation devices with lower drive strength of 12mA. LVC (...)

Benutzerhandbuch: PDF
Evaluierungsplatine

TMP126EVM — TMP126 – Evaluierungsmodul für hochpräzise SPI-Temperatursensoren

Der TMP126-Q1 ist ein hochgenauer, digitaler 0,5&Grad;C-Temperatursensor, der einen Umgebungstemperaturbereich von -55&Grad;C bis 175&Grad;C unterstützt Der TMP126-Q1 verfügt über eine signierte 14-Bit-Temperaturauflösung (0,03125°C pro LSB) beim Betrieb über einen Versorgungsspannungsbereich (...)

Benutzerhandbuch: PDF | HTML
Simulationsmodell

HSPICE MODEL OF SN74LVC1T45

SCEJ231.ZIP (94 KB) - HSpice Model
Simulationsmodell

SN74LVC1T45 IBIS Model (Rev. C)

SCEM401C.ZIP (99 KB) - IBIS Model
Simulationsmodell

SN74LVC1T45 TINA-TI Reference Design (Rev. A)

SCEM545A.TSC (23812 KB) - TINA-TI Reference Design
Simulationsmodell

SN74LVC1T45 TINA-TI Spice Model (Rev. A)

SCEM546A.ZIP (7 KB) - TINA-TI Spice Model
Referenzdesigns

TIDA-060025 — Reference design zum Maximieren der Transimpedanz-Bandbreite für LIDAR- und Time-of-Flight-Anwendung

This design demonstrates a high-speed optical front-end with a Time of Flight (ToF) distance measurement circuit using a fiber-optic transmission medium, which can be adapted to any type of ToF measurement such as through free space. This design features an industry-leading 2.5-V output linear (...)
Design guide: PDF
Schaltplan: PDF
Referenzdesigns

TIDC-CC3200MODLAUNCHXL — SimpleLink™ Wi-Fi® LaunchPad für CC3200 Module

Das CC3200MODLAUNCHXL ist eine kostengünstige Evaluierungsplattform, auf der das CC3200MOD läuft. Der SimpleLink™ CC3200MOD ist ein drahtloses Mikrocontroller (MCU)-Modul, das eine ARM® Cortex™-M4-basierte MCU integriert und es Kunden ermöglicht, eine komplette Anwendung mit einem (...)
Benutzerhandbuch: PDF
Schaltplan: PDF
Referenzdesigns

TIDEP0046 — Referenzdesign zur Monte-Carlo-Simulation auf dem AM57x mit OpenCL für DSP-Beschleunigung

TI’s high performance ARM® Cortex®-A15 based AM57x processors also integrate C66x DSPs. These DSPs were designed to handle high signal and data processing tasks that are often required by industrial, automotive and financial applications. The AM57x OpenCL implementation makes it easy (...)
Design guide: PDF
Schaltplan: PDF
Referenzdesigns

TIDEP0047 — Stromversorgungs- und Temperaturüberlegungen bei Verwendung des TI-Referenzdesigns mit dem AM57x-Pro

This is a reference design based on the AM57x processor and companion TPS659037 power management integrated circuit (PMIC).  This design specifically highlights important power and thermal design considerations and techniques for systems designed with AM57x and TPS659037.  It includes (...)
Design guide: PDF
Schaltplan: PDF
Referenzdesigns

TIDA-00725 — Referenzdesign für optisches Breitband-Frontend

This reference design implements and measures a complete 120MHz wide bandwidth optical front end comprising a high speed transimpedance amplifier, fully differential amplifier, and high speed 14-bit 160MSPS ADC with JESD204B interface.  Hardware and software are provided to evaluate the (...)
Design guide: PDF
Schaltplan: PDF
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
DSBGA (YZP) 6 Ultra Librarian
SOT-23 (DBV) 6 Ultra Librarian
SOT-5X3 (DRL) 6 Ultra Librarian
SOT-SC70 (DCK) 6 Ultra Librarian
USON (DPK) 6 Ultra Librarian

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

Videos