CD40175B

ACTIVO

CMOS cuádruple con flip flops tipo D

Detalles del producto

Number of channels 4 Technology family CD4000 Supply voltage (min) (V) 3 Supply voltage (max) (V) 18 Input type Standard CMOS Output type Push-Pull Clock frequency (max) (MHz) 14 IOL (max) (mA) 6.8 IOH (max) (mA) -6.8 Supply current (max) (µA) 600 Features Balanced outputs, Positive input clamp diode, Standard speed (tpd > 50ns) Operating temperature range (°C) -55 to 125 Rating Catalog
Number of channels 4 Technology family CD4000 Supply voltage (min) (V) 3 Supply voltage (max) (V) 18 Input type Standard CMOS Output type Push-Pull Clock frequency (max) (MHz) 14 IOL (max) (mA) 6.8 IOH (max) (mA) -6.8 Supply current (max) (µA) 600 Features Balanced outputs, Positive input clamp diode, Standard speed (tpd > 50ns) Operating temperature range (°C) -55 to 125 Rating Catalog
PDIP (N) 16 181.42 mm² 19.3 x 9.4 SOIC (D) 16 59.4 mm² 9.9 x 6 SOP (NS) 16 79.56 mm² 10.2 x 7.8 TSSOP (PW) 16 32 mm² 5 x 6.4
  • 100% tested for quiescent current at 20 V
  • Maximum input current of 1 µA at 18 V over full package-temperature range; 100 nA at 18 V and 25°C
  • Noise margin (full package-temperature range) =
            1 V at VDD = 5 V
            2 V at VDD = 10 V
         2.5 V at VDD = 15 V
  • 5-V, 10-V, and 15-V parametric ratings
  • Meets all requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of ’B’ Series CMOS Devices"
  • Output compatible with two HTL loads, two low power TTL loads, or one low power Schottky TTL load
  • Functional equivalent to TTL74175
  • Standardized, symmetrical output characteristics
  • Applications:
    • Shift registers
    • Buffer/storage registers
    • Pattern generators

  • 100% tested for quiescent current at 20 V
  • Maximum input current of 1 µA at 18 V over full package-temperature range; 100 nA at 18 V and 25°C
  • Noise margin (full package-temperature range) =
            1 V at VDD = 5 V
            2 V at VDD = 10 V
         2.5 V at VDD = 15 V
  • 5-V, 10-V, and 15-V parametric ratings
  • Meets all requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of ’B’ Series CMOS Devices"
  • Output compatible with two HTL loads, two low power TTL loads, or one low power Schottky TTL load
  • Functional equivalent to TTL74175
  • Standardized, symmetrical output characteristics
  • Applications:
    • Shift registers
    • Buffer/storage registers
    • Pattern generators

Cd40175B consists of four identical D-type flip-flops. Each flip-flop has an independent DATA D input and complementary Q and Q\ outputs. The CLOCK and CLEAR inputs are common to all flip-flops. Data are transferred to the Q outputs on the positive-going transition of the clock pulse. All four flip-flops are simultaneously reset by a low level on the CLEAR input.

These devices can function as shift register elements or as T-type flip-flops for toggle and counter applications.

The CD40175B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT and NSR suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffixes).

Cd40175B consists of four identical D-type flip-flops. Each flip-flop has an independent DATA D input and complementary Q and Q\ outputs. The CLOCK and CLEAR inputs are common to all flip-flops. Data are transferred to the Q outputs on the positive-going transition of the clock pulse. All four flip-flops are simultaneously reset by a low level on the CLEAR input.

These devices can function as shift register elements or as T-type flip-flops for toggle and counter applications.

The CD40175B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT and NSR suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffixes).

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Documentación técnica

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Tipo Título Fecha
* Data sheet CD40175B TYPES datasheet (Rev. C) 13 oct 2003
Application note Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 15 dic 2022
Selection guide Logic Guide (Rev. AB) 12 jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 dic 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 ene 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004
User guide Signal Switch Data Book (Rev. A) 14 nov 2003
Application note Understanding Buffered and Unbuffered CD4xxxB Series Device Characteristics 03 dic 2001

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

14-24-LOGIC-EVM — Módulo de evaluación genérico de productos lógicos para encapsulados D, DB, DGV, DW, DYY, NS y PW de

El módulo de evaluación 14-24-LOGIC-EVM (EVM) está diseñado para admitir cualquier dispositivo lógico que esté en un encapsulado D, DW, DB, NS, PW, DYY o DGV de 14 a 24 pines.

Guía del usuario: PDF | HTML
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
PDIP (N) 16 Ultra Librarian
SOIC (D) 16 Ultra Librarian
SOP (NS) 16 Ultra Librarian
TSSOP (PW) 16 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

Si tiene preguntas sobre la calidad, el paquete o el pedido de productos de TI, consulte el soporte de TI. ​​​​​​​​​​​​​​

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