CY54FCT574T

ACTIVO

Biestables tipo D con activación de borde octal con salidas de 3 estados

Detalles del producto

Technology family FCT Operating temperature range (°C) -55 to 125 Rating Military
Technology family FCT Operating temperature range (°C) -55 to 125 Rating Military
CDIP (J) 20 167.464 mm² 24.2 x 6.92 LCCC (FK) 20 79.0321 mm² 8.89 x 8.89
  • Function, Pinout, and Drive Compatible With FCT and F Logic
  • Reduced VOH (Typically = 3.3 V) Versions of Equivalent FCT Functions
  • Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics
  • Ioff Supports Partial-Power-Down Mode Operation
  • Matched Rise and Fall Times
  • Fully Compatible With TTL Input and Output Logic Levels
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
  • Edge-Triggered D-Type Inputs
  • 250-MHz Typical Switching Rate
  • CY54FCT574T
    • 32-mA Output Sink Current
    • 12-mA Output Source Current
  • CY74FCT574T
    • 64-mA Output Sink Current
    • 32-mA Output Source Current
  • 3-State Outputs

  • Function, Pinout, and Drive Compatible With FCT and F Logic
  • Reduced VOH (Typically = 3.3 V) Versions of Equivalent FCT Functions
  • Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics
  • Ioff Supports Partial-Power-Down Mode Operation
  • Matched Rise and Fall Times
  • Fully Compatible With TTL Input and Output Logic Levels
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
  • Edge-Triggered D-Type Inputs
  • 250-MHz Typical Switching Rate
  • CY54FCT574T
    • 32-mA Output Sink Current
    • 12-mA Output Source Current
  • CY74FCT574T
    • 64-mA Output Sink Current
    • 32-mA Output Source Current
  • 3-State Outputs

The \x92FCT574T devices are high-speed, low-power, octal D-type flip-flops, featuring separate D-type inputs for each flip-flop. These devices have 3-state outputs for bus-oriented applications. A buffered clock (CP) and output-enable (OE\) inputs are common to all flip-flops. The \x92FCT574T are identical to \x92FCT374T, except for a flow-through pinout to simplify board design. The eight flip-flops in the \x92FCT574T store the state of their individual D inputs that meet the setup-time and hold-time requirements on the low-to-high CP transition. When OE\ is low, the contents of the eight flip-flops are available at the outputs. When OE\ is high, the outputs are in the high-impedance state. The state of OE\ does not affect the state of the flip-flops.

These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

The \x92FCT574T devices are high-speed, low-power, octal D-type flip-flops, featuring separate D-type inputs for each flip-flop. These devices have 3-state outputs for bus-oriented applications. A buffered clock (CP) and output-enable (OE\) inputs are common to all flip-flops. The \x92FCT574T are identical to \x92FCT374T, except for a flow-through pinout to simplify board design. The eight flip-flops in the \x92FCT574T store the state of their individual D inputs that meet the setup-time and hold-time requirements on the low-to-high CP transition. When OE\ is low, the contents of the eight flip-flops are available at the outputs. When OE\ is high, the outputs are in the high-impedance state. The state of OE\ does not affect the state of the flip-flops.

These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

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* Data sheet 8-Bit Registers With 3-State Outputs datasheet 11 oct 2001

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

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