The \x92FCT574T devices are high-speed, low-power, octal D-type flip-flops, featuring separate D-type inputs for each flip-flop. These devices have 3-state outputs for bus-oriented applications. A buffered clock (CP) and output-enable (OE\) inputs are common to all flip-flops. The \x92FCT574T are identical to \x92FCT374T, except for a flow-through pinout to simplify board design. The eight flip-flops in the \x92FCT574T store the state of their individual D inputs that meet the setup-time and hold-time requirements on the low-to-high CP transition. When OE\ is low, the contents of the eight flip-flops are available at the outputs. When OE\ is high, the outputs are in the high-impedance state. The state of OE\ does not affect the state of the flip-flops.
These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
| Tipo | Título | Fecha | ||
|---|---|---|---|---|
| * | Data sheet | 8-Bit Registers With 3-State Outputs datasheet | 11 oct 2001 | |
| Application note | Power-Up Behavior of Clocked Devices (Rev. B) | PDF | HTML | 15 dic 2022 | |
| Selection guide | Logic Guide (Rev. AB) | 12 jun 2017 | ||
| Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 02 dic 2015 | ||
| User guide | LOGIC Pocket Data Book (Rev. B) | 16 ene 2007 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 08 jul 2004 | ||
| Application note | Selecting the Right Level Translation Solution (Rev. A) | 22 jun 2004 | ||
| User guide | CYFCT Parameter Measurement Information | 02 abr 2001 | ||
| Selection guide | Advanced Bus Interface Logic Selection Guide | 09 ene 2001 |
Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.
El módulo de evaluación (EVM) 14-24-LOGIC-EVM está diseñado para admitir cualquier dispositivo lógico que esté en un empaquetado D, DW, DB, NS, PW, DYY o DGV de 14 a 24 pines.
| Encapsulado | Pines | Símbolos CAD, huellas y modelos 3D |
|---|---|---|
| SOIC (DW) | 20 | Ultra Librarian |
| SSOP (DBQ) | 20 | Ultra Librarian |
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