SN74AUC240

ACTIVO

Inversores de alta velocidad, de 8 canales, 0.8 V a 2.7 V con salidas de 3 estados

Detalles del producto

Technology family AUC Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 2.7 Number of channels 8 IOL (max) (mA) 9 IOH (max) (mA) -9 Supply current (max) (µA) 20 Input type Standard CMOS Output type 3-State Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Ultra high speed (tpd <5ns) Rating Catalog Operating temperature range (°C) -40 to 85
Technology family AUC Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 2.7 Number of channels 8 IOL (max) (mA) 9 IOH (max) (mA) -9 Supply current (max) (µA) 20 Input type Standard CMOS Output type 3-State Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Ultra high speed (tpd <5ns) Rating Catalog Operating temperature range (°C) -40 to 85
VQFN (RGY) 20 15.75 mm² 4.5 x 3.5
  • Optimized for 1.8-V Operation and is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • Ioff Supports Partial-Power-Down Mode Operation
  • Sub 1-V Operable
  • Max tpd of 1.7 ns at 1.8 V
  • Low Power Consumption, 20-µA Max ICC
  • ±8-mA Output Drive at 1.8 V
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

  • Optimized for 1.8-V Operation and is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • Ioff Supports Partial-Power-Down Mode Operation
  • Sub 1-V Operable
  • Max tpd of 1.7 ns at 1.8 V
  • Low Power Consumption, 20-µA Max ICC
  • ±8-mA Output Drive at 1.8 V
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

This octal buffer/driver is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation.

The SN74AUC240 is designed specifically to improve the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

This device is organized as two 4-bit buffers/drivers with separate output-enable (OE)\ inputs. When OE\ is low, the device passes data from the A inputs to the Y outputs. When OE\ is high, the outputs are in the high-impedance state.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

This octal buffer/driver is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation.

The SN74AUC240 is designed specifically to improve the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

This device is organized as two 4-bit buffers/drivers with separate output-enable (OE)\ inputs. When OE\ is low, the device passes data from the A inputs to the Y outputs. When OE\ is high, the outputs are in the high-impedance state.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

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Documentación técnica

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Tipo Título Fecha
* Data sheet SN74AUC240 datasheet (Rev. A) 20 mar 2003
Selection guide Little Logic Guide 2018 (Rev. G) 06 jul 2018
Selection guide Logic Guide (Rev. AB) 12 jun 2017
Application note How to Select Little Logic (Rev. A) 26 jul 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 dic 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 ene 2007
Product overview Design Summary for WCSP Little Logic (Rev. B) 04 nov 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 jun 2004
User guide Signal Switch Data Book (Rev. A) 14 nov 2003
Application note Designing With TI Ultra-Low-Voltage CMOS (AUC) Octals and Widebus Devices 21 mar 2003
User guide AUC Data Book, January 2003 (Rev. A) 01 ene 2003
Application note Texas Instruments Little Logic Application Report 01 nov 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 ago 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards 13 jun 2002
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS 27 mar 2002
More literature AUC Product Brochure (Rev. A) 18 mar 2002

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

14-24-NL-LOGIC-EVM — Módulo de evaluación genérico de productos lógicos para encapsulados sin conductores de 14 a 24 pine

14-24-NL-LOGIC-EVM es un módulo de evaluación (EVM) flexible diseñado para admitir cualquier dispositivo lógico o de traducción que tenga un encapsulado BQA, BQB, RGY, RSV, RJW o RHL de 14 a 24 pines.

Guía del usuario: PDF | HTML
Modelo de simulación

SN74AUC240 Behavioral SPICE Model

SCEM717.ZIP (7 KB) - PSpice Model
Modelo de simulación

SN74AUC240 IBIS Model

SCEM330.ZIP (67 KB) - IBIS Model
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
VQFN (RGY) 20 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

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