SN74AUP1G74

ACTIVO

Biestable único de tipo D con activación de borde positivo de baja potencia

Detalles del producto

Number of channels 1 Technology family AUP Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 3.6 Input type Standard CMOS Output type Push-Pull Clock frequency (max) (MHz) 160 IOL (max) (mA) 4 IOH (max) (mA) -4 Supply current (max) (µA) 0.9 Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Operating temperature range (°C) -40 to 85 Rating Catalog
Number of channels 1 Technology family AUP Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 3.6 Input type Standard CMOS Output type Push-Pull Clock frequency (max) (MHz) 160 IOL (max) (mA) 4 IOH (max) (mA) -4 Supply current (max) (µA) 0.9 Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Operating temperature range (°C) -40 to 85 Rating Catalog
DSBGA (YFP) 8 1.8 mm² 1 x 1.8 DSBGA (YZP) 8 2.8125 mm² 2.25 x 1.25 UQFN (RSE) 8 2.25 mm² 1.5 x 1.5 VSSOP (DCU) 8 6.2 mm² 2 x 3.1 X2SON (DQE) 8 1.4 mm² 1.4 x 1
  • Available in the Texas Instruments NanoStar Package
  • Low Static-Power Consumption: ICC = 0.9 μA Maximum
  • Low Dynamic-Power Consumption: Cpd = 5.5 pF Typical at 3.3 V
  • Low Input Capacitance: Ci = 1.5 pF Typical
  • Low Noise – Overshoot and Undershoot < 10% of VCC
  • Ioff Supports Partial-Power-Down Mode Operation
  • Schmitt-Trigger Action Allows Slow Input Transition and Better Switching Noise Immunity at the Input (Vhys = 250 mV Typical at 3.3 V)
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 5 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • NanoStar Is a trademark of Texas Instruments. All other trademarks are the property of their respective owners

  • APPLICATIONS
    • Servers
    • LED Displays
    • Network Switches
    • Telecom Infrastructure
    • Motor Drivers
    • I/O Expanders
  • Available in the Texas Instruments NanoStar Package
  • Low Static-Power Consumption: ICC = 0.9 μA Maximum
  • Low Dynamic-Power Consumption: Cpd = 5.5 pF Typical at 3.3 V
  • Low Input Capacitance: Ci = 1.5 pF Typical
  • Low Noise – Overshoot and Undershoot < 10% of VCC
  • Ioff Supports Partial-Power-Down Mode Operation
  • Schmitt-Trigger Action Allows Slow Input Transition and Better Switching Noise Immunity at the Input (Vhys = 250 mV Typical at 3.3 V)
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 5 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • NanoStar Is a trademark of Texas Instruments. All other trademarks are the property of their respective owners

  • APPLICATIONS
    • Servers
    • LED Displays
    • Network Switches
    • Telecom Infrastructure
    • Motor Drivers
    • I/O Expanders
  • The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life. This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in ).

    The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life. This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in ).

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    Documentación técnica

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    Tipo Título Fecha
    * Data sheet SN74AUP1G74 Low-Power Single Positive-Edge-Triggered D-Type Flip-Flop With Clear and Preset datasheet (Rev. D) PDF | HTML 29 dic 2015
    Application note Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 15 dic 2022
    Application brief Understanding Schmitt Triggers (Rev. A) PDF | HTML 22 may 2019
    Selection guide Little Logic Guide 2018 (Rev. G) 06 jul 2018
    Selection guide Logic Guide (Rev. AB) 12 jun 2017
    Application note How to Select Little Logic (Rev. A) 26 jul 2016
    Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004

    Diseño y desarrollo

    Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

    Placa de evaluación

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    Módulo de evaluación (EVM) flexible diseñado para admitir cualquier dispositivo que tenga un encapsulado DCK, DCT, DCU, DRL o DBV en un recuento de 5 a 8 pines.
    Guía del usuario: PDF
    Diseños de referencia

    TIDM-SERVODRIVE — Diseño de referencia de inversor de CA y servomotor industrial

    The DesignDRIVE Development Kit is a reference design for a complete industrial drive directly connecting to a three phase ACI or PMSM motor. Many drive topologies can be created from the combined control, power and communications technologies included on this single platform.  Includes (...)
    Design guide: PDF
    Esquema: PDF
    Diseños de referencia

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    The solid state relay 24V AC Switch reference design is a single relay replacement that enables efficient power management for a low power alternative to standard electromechanical relays.  The OFF-mode provides energy to the system controller and the ON mode can switch fast enough to allow (...)
    Design guide: PDF
    Esquema: PDF
    Diseños de referencia

    TIDA-00377 — Diseño de referencia de relé de estado sólido de CA autoalimentado con MOSFET

    The self-powered AC solid state relay with MOSFETs reference design is a single relay replacement that enables efficient power management for a low-power alternative to standard electromechanical relays in thermostat applications. This SSR reference design is self-powered through the 24V AC power (...)
    Design guide: PDF
    Esquema: PDF
    Diseños de referencia

    TIDA-01064 — Relé de estado sólido AC con BOM de bajo costo y diseño de referencia MOSFET

    The low BOM cost ac solid state relay with MOSFETs reference design is a single relay replacement that enables efficient power management for a low-power alternative to standard electromechanical relays in thermostat applications. This SSR reference design is the base model of the self-powered (...)
    Design guide: PDF
    Esquema: PDF
    Diseños de referencia

    TIDA-00616 — Diseño de referencia de LaunchPad BoosterPack para captación de energía para el control del motor de

    El LaunchPad para la captación de energía para el control de motor de CC con escobillas está diseñado para cargar una batería de iones de litio o polímero de litio con energía solar y, posteriormente, usar un regulador de tensión para proporcionar alimentación del sistema secundaria a un LaunchPad (...)
    Design guide: PDF
    Esquema: PDF
    Encapsulado Pines Símbolos CAD, huellas y modelos 3D
    DSBGA (YFP) 8 Ultra Librarian
    DSBGA (YZP) 8 Ultra Librarian
    UQFN (RSE) 8 Ultra Librarian
    VSSOP (DCU) 8 Ultra Librarian
    X2SON (DQE) 8 Ultra Librarian

    Pedidos y calidad

    Información incluida:
    • RoHS
    • REACH
    • Marcado del dispositivo
    • Acabado de plomo/material de la bola
    • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
    • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
    • Contenido del material
    • Resumen de calificaciones
    • Monitoreo continuo de confiabilidad
    Información incluida:
    • Lugar de fabricación
    • Lugar de ensamblaje

    Soporte y capacitación

    Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

    El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

    Si tiene preguntas sobre la calidad, el paquete o el pedido de productos de TI, consulte el soporte de TI. ​​​​​​​​​​​​​​

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