DS90C383
FPD-Link (フラット パネル ディスプレイ リンク) 向け、65MHz クロック対応、24 ビット、3.3V、プログラマブル LVDS トランスミッタ
DS90C383
- 20 to 65 MHz shift clock support
- Programmable transmitter (DS90C383) strobe select (Rising or Falling edge strobe)
- Single 3.3V supply
- Chipset (Tx + Rx) power consumption < 250 mW (typ)
- Power-down mode (< 0.5 mW total)
- Single pixel per clock XGA (1024×768) ready
- Supports VGA, SVGA, XGA and higher addressability.
- Up to 227 Megabytes/sec bandwidth
- Up to 1.8 Gbps throughput
- Narrow bus reduces cable size and cost
- 290 mV swing LVDS devices for low EMI
- PLL requires no external components
- Low profile 56-lead TSSOP package.
- Also available in a 64 ball, 0.8mm fine pitch ball grid array (FBGA) package
- Falling edge data strobe Receiver
- Compatible with TIA/EIA-644 LVDS standard
- ESD rating >7 kV
- Operating Temperature: -40°C to +85°C
TRI-STATE® is a registered trademark of National Semiconductor Corporation.
The DS90C383 transmitter converts 28 bits of LVCMOS/LVTTL data into four LVDS (Low Voltage Differential Signaling) data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fifth LVDS link. Every cycle of the transmit clock 28 bits of input data are sampled and transmitted. The DS90CF384 receiver converts the LVDS data streams back into 28 bits of LVCMOS/LVTTL data. At a transmit clock frequency of 65 MHz, 24 bits of RGB data and 3 bits of LCD timing and control data (FPLINE, FPFRAME, DRDY) are transmitted at a rate of 455 Mbps per LVDS data channel. Using a 65 MHz clock, the data throughputs is 227 Mbytes/sec. The transmitter is offered with programmable edge data strobes for convenient interface with a variety of graphics controllers. The transmitter can be programmed for Rising edge strobe or Falling edge strobe through a dedicated pin. A Rising edge transmitter will inter-operate with a Falling edge receiver (DS90CF384) without any translation logic. Both devices are also offered in a 64 ball, 0.8mm fine pitch ball grid array (FBGA) package which provides a 44 % reduction in PCB footprint compared to the TSSOP package.
This chipset is an ideal means to solve EMI and cable size problems associated with wide, high speed TTL interfaces.
技術資料
種類 | タイトル | 最新の英語版をダウンロード | 日付 | |||
---|---|---|---|---|---|---|
* | データシート | DS90C383/F384 3.3VProg LVDS Trans 24Bit FPD, 65MHz,3.3VLVDS Rcvr 24Bit FPD(jp) データシート (Rev. A 翻訳版) | 英語版 (Rev.A) | PDF | HTML | 2004年 5月 13日 |
購入と品質
- RoHS
- REACH
- デバイスのマーキング
- リード端子の仕上げ / ボールの原材料
- MSL 定格 / ピーク リフロー
- MTBF/FIT 推定値
- 使用原材料
- 認定試験結果
- 継続的な信頼性モニタ試験結果
- ファブの拠点
- 組み立てを実施した拠点