BUF11704
- Wide Supply Range: 4.5 V to 18 V
- Gamma Correction Channels: 10, 6, and 4
- Integrated VCOM Buffer
- Excellent Output Current Drive:
- Gamma Channels:
> 30 mA at 0.5 V Swing to Rails(1) - VCOM:
> 100 mA typ at 2 V Swing to Rails(1)
- Gamma Channels:
- Large Capacitive Load Drive Capability
- Rail-to-Rail Output
- PowerPAD™ Package
- Low-Power/Channel: < 500 µA
- High ESD Rating: 8 kV HBM, 2 kV CDM, 300 V MM
- Specified for –25°C to +85°C
(1) See Typical Characteristic curves for details.
PowerPAD is a trademark of Texas Instruments Incorporated.
All other trademarks are the property of their respective owners.
The BUFxx704 are a series of multi-channel buffers targeted towards gamma correction in high-resolution LCD panels. They are pin-compatible with the existing BUFxx702 and BUFxx703 families and operate at higher supply voltages up to 18 V (19 V absolute max). The higher supply voltage enables faster response times and brighter images in large-screen LCD panels. This is especially important in LCD TV applications.
The number of gamma correction channels required depends on a variety of factors and differs greatly from design to design. Therefore, 10, 6, and 4 channel options are offered. For additional space and cost savings, a VCOM channel with > 100mA drive capability is integrated into the BUF11704, BUF07704, and BUF05704.
The BUF11704, BUF07704, BUF06704, and BUF05704 are available in the TSSOP-28, TSSOP-20, TSSOP-16, and TSSOP-14 PowerPAD packages for dramatically increased power dissipation capability. This way, a large number of channels can be handled safely in one package.
A flow-through pinout has been adopted to allow simple PCB routing and maintain the cost-effectiveness of this solution. All inputs and outputs of the BUFxx704 incorporate internal ESD protection circuits that prevent functional failures at voltages up to 8 kV (HBM), 2 kV (CDM), and 300 V (MM).
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | BUFxx704: 18-V Supply Multi-Channel Gamma Correction Buffer datasheet (Rev. F) | 2007/12/05 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치