CLC007
- No External Pull-Down Resistors
- Differential Input and Output
- Low Power Dissipation
- Single +5V or −5.2V Supply
- Replaces GS9007 in Most Applications
Key Specifications
- 650 ps Rise and Fall Times
- Data Rates to 400 Mbps
- 2 Sets of Complimentary Outputs
- 200 mV Differential Input
- Low Residual Jitter (25 pspp)
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The Texas Instruments Comlinear CLC007 is a monolithic, high-speed cable driver designed for the SMPTE 259M serial digital video data transmission standard. The CLC007 drives 75Ω transmission lines (Belden 8281 or equivalent) at data rates up to 400 Mbps. Controlled output rise and fall times (750 ps typical) minimize transition-induced jitter. The output voltage swing, typically 1.65V, set by an accurate, low-drift internal bandgap reference, delivers an 800 mV swing to back-matched and terminated 75Ω cable.
The CLC007’s class AB output stage consumes less power than other designs, 195 mW with all outputs terminated, and requires no external bias resistors. The differential inputs accept a wide range of digital signals from 200 mVP-P to ECL levels within the specified common-mode limits. All this make the CLC007 an excellent general purpose high speed driver for digital applications.
The CLC007 is powered from a single +5V or −5.2V supply and comes in an 8-pin SOIC package.
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | CLC007 Serial Digital Cable Driver with Dual Complementary Outputs datasheet (Rev. E) | 2013/04/12 | |
| Application note | AN-1943 Understanding Serial Digital Video Bit Rates (Rev. A) | 2013/04/26 | ||
| Application note | AN-2145 Power Considerations for SDI Products (Rev. B) | 2013/04/26 | ||
| Application note | AN-2146 Power Design for SDI and Other Noise-Sensitive Devices (Rev. A) | 2013/04/26 | ||
| Application note | High-Speed Board Layout Challenges in FPGA/SDI Sub-Systems | 2009/11/12 | ||
| Application note | Use Video Standards for Eye-Opening Data Transmission: Mega-bits @ Many Meters | 1999/12/29 |
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TINA-TI — SPICE 기반 아날로그 시뮬레이션 프로그램
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| SOIC (D) | 8 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치