DSLVDS1047
- Designed for Signaling Rates up to 400-Mbps
- 3.3-V Power Supply Design
- 300-ps Typical Differential Skew
- 400-ps Maximum Differential Skew
- 1.7-ns Maximum Propagation Delay
- ±350-mV Differential Signaling
- Low Power Dissipation (13 mW at 3.3-V Static)
- Interoperable With Existing 5-V LVDS Receivers
- High impedance on LVDS Outputs on Power Down
- Flow-Through Pinout Simplifies PCB Layout
- Meets or Exceeds TIA/EIA-644 LVDS Standard
- Industrial Operating Temperature Range
(−40°C to +85°C) - Available in TSSOP Package
The DSLVDS1047 device is a quad CMOS flow-through differential line driver designed for applications requiring ultra-low power dissipation and high data rates. The device is designed to support data rates in excess of 400 Mbps (200 MHz) using Low Voltage Differential Signaling (LVDS) technology.
The DSLVDS1047 accepts low voltage TTL/CMOS input levels and translates them to low voltage
(350 mV) differential output signals. In addition, the driver supports a TRI-STATE function that may be used to disable the output stage, disabling the load current, and thus dropping the device to an ultra low idle power state of 13 mW typical. The DSLVDS1047 has a flow-through pinout for easy PCB layout.
The EN and EN* inputs are ANDed together and control the TRI-STATE outputs. The enables are common to all four drivers. The and companion line receiver (DSLVDS1048) provide a new alternative to high power psuedo-ECL devices for high speed point-to-point interface applications.
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | DSLVDS1047 3.3-V LVDS Quad Channel High-Speed Differential Line Driver datasheet | PDF | HTML | 2018/09/27 |
| Application note | Applications of Low-Voltage Differential Signaling (LVDS) in LED Walls | 2020/10/29 | ||
| Application note | Applications of Low-Voltage Differential Signaling (LVDS) in Ultrasound Scanners | 2019/06/29 | ||
| Application brief | LVDS to Improve EMC in Motor Drives | 2018/09/27 | ||
| EVM User's guide | DSLVDS1047-1048EVM User's Guide | 2018/08/23 | ||
| Application brief | How Far, How Fast Can You Operate LVDS Drivers and Receivers? | 2018/08/03 | ||
| Application brief | How to Terminate LVDS Connections with DC and AC Coupling | 2018/05/16 | ||
| Application note | An Overview of LVDS Technology | 1998/10/05 |
설계 및 개발
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| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| TSSOP (PW) | 16 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
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