인터페이스 PCIe, SAS 및 SATA IC

HD3SS3412

활성

3.3V, 4채널 아날로그 차동 스위치

제품 상세 정보

Type Passive mux Protocols PCIe1, PCIe2, PCIe3 Applications PCIe, SAS, SATA, USB 3.1 Number of channels 4 Speed (max) (Gbpp) 12 Supply voltage (V) 3.3 Rating Catalog Operating temperature range (°C) 0 to 70
Type Passive mux Protocols PCIe1, PCIe2, PCIe3 Applications PCIe, SAS, SATA, USB 3.1 Number of channels 4 Speed (max) (Gbpp) 12 Supply voltage (V) 3.3 Rating Catalog Operating temperature range (°C) 0 to 70
WQFN (RUA) 42 31.5 mm² 9 x 3.5
  • Compatible With Multiple Interface Standards Operating up to 12 Gbps Including PCI Express Gen III and USB 3.0
  • Wide –3dB Differential BW of over 8 GHz
  • Excellent Dynamic Characteristics (at 4 GHz)
    • Crosstalk = –35 dB
    • Off Isolation = –19 dB
    • Insertion Loss = –1.5 dB
    • Return Loss = –11 dB
  • Bidirectional "MUX/De-MUX" Type Differential Switch
  • VDD Operating Range 3.3 V ±10%
  • Small 3.5-mm × 9.0-mm, 42-Pin WQFN Package
  • Common Industry Standard Pinout
  • Supports XAUI and SGMII
  • Compatible With Multiple Interface Standards Operating up to 12 Gbps Including PCI Express Gen III and USB 3.0
  • Wide –3dB Differential BW of over 8 GHz
  • Excellent Dynamic Characteristics (at 4 GHz)
    • Crosstalk = –35 dB
    • Off Isolation = –19 dB
    • Insertion Loss = –1.5 dB
    • Return Loss = –11 dB
  • Bidirectional "MUX/De-MUX" Type Differential Switch
  • VDD Operating Range 3.3 V ±10%
  • Small 3.5-mm × 9.0-mm, 42-Pin WQFN Package
  • Common Industry Standard Pinout
  • Supports XAUI and SGMII

The HD3SS3412 device is a high-speed passive switch capable of switching four differential channels, including applications such as two full PCI Express x1 lanes from one source to one of two target locations in a PC/server application. With its bidirectional capability the HD3SS3412 also supports applications that allow connections between one target and two source devices, such as a shared peripheral between two platforms. The HD3SS3412 has a single control line (SEL pin) which can be used to control the signal path between Port A and either Port B or Port C.

The HD3SS3412 is offered in an industry standard 42-pin WQFN package available in a common footprint shared by several other vendors. The device is specified to operate from a single supply voltage of 3.3 V over the full temperature range of -40°C to 85ºC.

The HD3SS3412 is a generic 4-CH high-speed MUX/de-MUX type of switch that can be used for routing high-speed signals between two different locations on a circuit board. Although it was designed specifically to address PCI Express Gen III applications, the HD3SS3412 will also support several other high-speed data protocols with a differential amplitude of <1800 mVpp and a common-mode voltage of < 2 V, as with USB 3.0 and DisplayPort 1.2. The device’s one select input (SEL) pin can easily be controlled by an available GPIO pin within a system or from a microcontroller.

The HD3SS3412 device is a high-speed passive switch capable of switching four differential channels, including applications such as two full PCI Express x1 lanes from one source to one of two target locations in a PC/server application. With its bidirectional capability the HD3SS3412 also supports applications that allow connections between one target and two source devices, such as a shared peripheral between two platforms. The HD3SS3412 has a single control line (SEL pin) which can be used to control the signal path between Port A and either Port B or Port C.

The HD3SS3412 is offered in an industry standard 42-pin WQFN package available in a common footprint shared by several other vendors. The device is specified to operate from a single supply voltage of 3.3 V over the full temperature range of -40°C to 85ºC.

The HD3SS3412 is a generic 4-CH high-speed MUX/de-MUX type of switch that can be used for routing high-speed signals between two different locations on a circuit board. Although it was designed specifically to address PCI Express Gen III applications, the HD3SS3412 will also support several other high-speed data protocols with a differential amplitude of <1800 mVpp and a common-mode voltage of < 2 V, as with USB 3.0 and DisplayPort 1.2. The device’s one select input (SEL) pin can easily be controlled by an available GPIO pin within a system or from a microcontroller.

다운로드 스크립트와 함께 비디오 보기 동영상

관심 가지실만한 유사 제품

open-in-new 대안 비교
비교 대상 장치와 유사한 기능
DS160PR412 활성 1:2 디멀티플렉서가 통합된 PCIe® 4.0, 16Gbps, 4채널 선형 리드라이버 Redriver with integrated mux
DS160PR421 활성 2:1 멀티플렉서가 통합된 PCIe® 4.0 16Gbps 4채널 선형 리드라이버 Redriver with integrated mux
HD3SS3411 활성 3.3V PCI Express 3.0 1채널 아날로그 차동 스위치 One channel version of HD3SS3412 with slightly lower BW of ~7.5MHz
HD3SS3411-Q1 활성 3.3V 오토모티브 PCI Express 3.0 1채널 아날로그 차동 스위치 One channel version of HD3SS3412 with slightly lower BW of ~7.5MHz, Q100 Automotive Qualified.

기술 자료

star =TI에서 선정한 이 제품의 인기 문서
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2개 모두 보기
유형 직함 날짜
* Data sheet HD3SS3412 4-Channel High-Performance Differential Switch datasheet (Rev. F) PDF | HTML 2018/07/18
Application note High-Speed Layout Guidelines for Signal Conditioners and USB Hubs 2018/06/14

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

시뮬레이션 모델

HD3SS3412 HSpice Model

SLAM141.ZIP (134 KB) - HSpice Model
시뮬레이션 모델

HD3SS3412 S-Parameter Model

SLAR107.ZIP (365 KB) - S-Parameter Model
시뮬레이션 툴

PSPICE-FOR-TI — TI 설계 및 시뮬레이션 툴용 PSpice®

TI용 PSpice®는 아날로그 회로의 기능을 평가하는 데 사용되는 설계 및 시뮬레이션 환경입니다. 완전한 기능을 갖춘 이 설계 및 시뮬레이션 제품군은 Cadence®의 아날로그 분석 엔진을 사용합니다. 무료로 제공되는 TI용 PSpice에는 아날로그 및 전력 포트폴리오뿐 아니라 아날로그 행동 모델에 이르기까지 업계에서 가장 방대한 모델 라이브러리 중 하나가 포함되어 있습니다.

TI 설계 및 시뮬레이션 환경용 PSpice는 기본 제공 라이브러리를 이용해 복잡한 혼합 신호 설계를 시뮬레이션할 수 있습니다. 레이아웃 및 제작에 (...)
시뮬레이션 툴

TINA-TI — SPICE 기반 아날로그 시뮬레이션 프로그램

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
사용 설명서: PDF
패키지 CAD 기호, 풋프린트 및 3D 모델
WQFN (RUA) 42 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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