홈 전원 관리 DC/DC 전력 모듈 벅 모듈(통합 인덕터)
홈
전원 관리
DC/DC 전력 모듈
벅 모듈(통합 인덕터)

LMZ30602

활성

2.95V~6V, 2A 스텝다운 전원 모듈(9x11x2.8mm QFN 패키지)

지금 주문
데이터 시트

이 제품의 최신 버전이 있습니다

open-in-new 대안 비교
다른 핀 출력을 지원하지만 비교 대상 장치와 동일한 기능
TPSM82822 활성 5.5V 입력, 2A, 감압 모듈 - 통합 인덕터, 2 x 2.5 x 1.1mm μSIP 패키지 Newer solution with smaller BOM size, lower Iq, higher voltage accuracy

LMZ30602

활성
데이터 시트 지금 주문

제품 상세 정보

Rating Catalog Operating temperature range (°C) -40 to 85 Topology Buck, Synchronous Buck Type Module Iout (max) (A) 2 Vin (min) (V) 2.95 Vin (max) (V) 6 Vout (min) (V) 0.8 Vout (max) (V) 3.6 Switching frequency (min) (kHz) 500 Switching frequency (max) (kHz) 2000 Features EMI Tested, Enable, Frequency synchronization, Power good, Remote Sense, Tracking Control mode Voltage mode Duty cycle (max) (%) 91
Rating Catalog Operating temperature range (°C) -40 to 85 Topology Buck, Synchronous Buck Type Module Iout (max) (A) 2 Vin (min) (V) 2.95 Vin (max) (V) 6 Vout (min) (V) 0.8 Vout (max) (V) 3.6 Switching frequency (min) (kHz) 500 Switching frequency (max) (kHz) 2000 Features EMI Tested, Enable, Frequency synchronization, Power good, Remote Sense, Tracking Control mode Voltage mode Duty cycle (max) (%) 91
B1QFN (RKG) 39 99 mm² 11 x 9
  • Complete Integrated Power Solution Allows
    Small Footprint, Low-Profile Design
  • 9 mm × 11 mm × 2.8 mm package
    - Pin Compatible with LMZ30604 and LMZ30606
  • Efficiencies Up To 96%
  • Wide-Output Voltage Adjust
    0.8 V to 3.6 V, with ±1% Reference Accuracy
  • Adjustable Switching Frequency
    (500 kHz to 2 MHz)
  • Synchronizes to an External Clock
  • Adjustable Slow-Start
  • Output Voltage Sequencing / Tracking
  • Power Good Output
  • Programmable Undervoltage Lockout (UVLO)
  • Output Overcurrent Protection
  • Over Temperature Protection
  • Operating Temperature Range: –40°C to 85°C
  • Enhanced Thermal Performance: 12°C/W
  • Meets EN55022 Class B Emissions
    - Integrated Shielded Inductor
  • Create a Custom Design Using the LMZ30602 With the WEBENCH® Power Designer
  • Complete Integrated Power Solution Allows
    Small Footprint, Low-Profile Design
  • 9 mm × 11 mm × 2.8 mm package
    - Pin Compatible with LMZ30604 and LMZ30606
  • Efficiencies Up To 96%
  • Wide-Output Voltage Adjust
    0.8 V to 3.6 V, with ±1% Reference Accuracy
  • Adjustable Switching Frequency
    (500 kHz to 2 MHz)
  • Synchronizes to an External Clock
  • Adjustable Slow-Start
  • Output Voltage Sequencing / Tracking
  • Power Good Output
  • Programmable Undervoltage Lockout (UVLO)
  • Output Overcurrent Protection
  • Over Temperature Protection
  • Operating Temperature Range: –40°C to 85°C
  • Enhanced Thermal Performance: 12°C/W
  • Meets EN55022 Class B Emissions
    - Integrated Shielded Inductor
  • Create a Custom Design Using the LMZ30602 With the WEBENCH® Power Designer

The LMZ30602 power module is an easy-to-use integrated power solution that combines a 2-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution requires as few as 3 external components and eliminates the loop compensation and magnetics part selection process.

The 9×11×2.8 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 12°C/W junction to ambient. The device delivers the full 2-A rated output current at 85°C ambient temperature without airflow.

The LMZ30602 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques.

The LMZ30602 power module is an easy-to-use integrated power solution that combines a 2-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution requires as few as 3 external components and eliminates the loop compensation and magnetics part selection process.

The 9×11×2.8 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 12°C/W junction to ambient. The device delivers the full 2-A rated output current at 85°C ambient temperature without airflow.

The LMZ30602 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques.
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기술 자료

star =TI에서 선정한 이 제품의 인기 문서
검색된 결과가 없습니다. 검색어를 지우고 다시 시도하십시오.
7개 모두 보기
유형 직함 날짜
* Data sheet LMZ30602 2-A Power Module With 2.95V-6V Input in QFN Package datasheet (Rev. B) 2018/04/11
Selection guide Innovative DC/DC Power Modules Selection Guide (Rev. D) 2021/10/14
Application note Soldering Requirements for BQFN Packages (Rev. C) 2020/03/05
White paper Simplify low EMI design with power modules 2017/11/20
Application note Working With QFN Power Modules (Rev. A) 2017/06/08
EVM User's guide Using the LMZ30606EVM-003, LMZ30604EVM-001, LMZ30602EVM-002 (Rev. A) 2014/03/06
Application note Adjusting LMZ3 Output Voltage with LM10010/1 2014/02/11

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

평가 보드

LMZ30606EVM-003 — 2.95V~6V, 6A 스텝다운 전원 모듈 평가 보드

The LMZ30606EVM-003 is a fully assembled and tested circuit for evaluating the LMZ30606. The output voltage can be selected from four preset values using a jumper (3.3V, 2.5V, 1.8V, 1.2V, and 0.8V) and has an adjustable switching frequency of 500 kHz to 1 MHz. Solder pads and jumpers are available (...)
사용 설명서: PDF
TI.com에서 구매 불가
시뮬레이션 모델

LMZ30602 PSpice Transient Model

SNVM516.ZIP (101 KB) - PSpice Model
다운로드
시뮬레이션 모델

LMZ30602 Unencrypted PSpice Transient Model

SNVM792.ZIP (7 KB) - PSpice Model
다운로드
레퍼런스 디자인

TIDA-010011 — 보호 릴레이 프로세서 모듈을 위한 고효율 전원 공급 장치 아키텍처 레퍼런스 설계

This reference design showcases various power architectures for generating multiple voltage rails for an application processor module, requiring >1A load current and high efficiency . The required power supply is generated using 5-, 12- or 24-V DC input from the backplane. Power supplies are (...)
Design guide: PDF
회로도: PDF
패키지 핀 CAD 기호, 풋프린트 및 3D 모델
B1QFN (RKG) 39 Ultra Librarian
TI의 평가 항목에 대한 표준 약관이 적용됩니다.

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

포럼 주제 모두 보기(영문)

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