LMZ30602
- Complete Integrated Power Solution Allows
Small Footprint, Low-Profile Design - 9 mm × 11 mm × 2.8 mm package
- Pin Compatible with LMZ30604 and LMZ30606 - Efficiencies Up To 96%
- Wide-Output Voltage Adjust
0.8 V to 3.6 V, with ±1% Reference Accuracy - Adjustable Switching Frequency
(500 kHz to 2 MHz) - Synchronizes to an External Clock
- Adjustable Slow-Start
- Output Voltage Sequencing / Tracking
- Power Good Output
- Programmable Undervoltage Lockout (UVLO)
- Output Overcurrent Protection
- Over Temperature Protection
- Operating Temperature Range: –40°C to 85°C
- Enhanced Thermal Performance: 12°C/W
- Meets EN55022 Class B Emissions
- Integrated Shielded Inductor - Create a Custom Design Using the LMZ30602 With the WEBENCH® Power Designer
The LMZ30602 power module is an easy-to-use integrated power solution that combines a 2-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution requires as few as 3 external components and eliminates the loop compensation and magnetics part selection process.
The 9×11×2.8 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 12°C/W junction to ambient. The device delivers the full 2-A rated output current at 85°C ambient temperature without airflow.
The LMZ30602 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques.
기술 자료
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
LMZ30606EVM-003 — 2.95V~6V, 6A 스텝다운 전원 모듈 평가 보드
TIDA-010011 — 보호 릴레이 프로세서 모듈을 위한 고효율 전원 공급 장치 아키텍처 레퍼런스 설계
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
B1QFN (RKG) | 39 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치