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다른 핀 출력을 지원하지만 비교 대상 장치와 동일한 기능
비교 대상 장치와 유사한 기능
LMZ30604
- Complete Integrated Power Solution Allows
Small Footprint, Low-Profile Design - 9 mm × 11 mm × 2.8 mm package
- Pin Compatible with LMZ30602 and LMZ30606 - Efficiencies Up To 96%
- Wide-Output Voltage Adjust
0.8 V to 3.6 V, with ±1% Reference Accuracy - Adjustable Switching Frequency
(500 kHz to 2 MHz) - Synchronizes to an External Clock
- Adjustable Slow-Start
- Output Voltage Sequencing / Tracking
- Power Good Output
- Programmable Undervoltage Lockout (UVLO)
- Output Overcurrent Protection
- Over Temperature Protection
- Operating Temperature Range: –40°C to 85°C
- Enhanced Thermal Performance: 12°C/W
- Meets EN55022 Class B Emissions
- Integrated Shielded Inductor - Create a Custom Design Using the LMZ30604 With the WEBENCH® Power Designer
The LMZ30604 power module is an easy-to-use integrated power solution that combines a 4-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution requires as few as 3 external components and eliminates the loop compensation and magnetics part selection process.
The 9×11×2.8 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 12°C/W junction to ambient. The device delivers the full 4-A rated output current at 85°C ambient temperature without airflow.
The LMZ30604 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques.
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | LMZ30604 4-A Power Module With 2.95V-6V Input in QFN Package datasheet (Rev. B) | 2018/04/11 | |
| Application note | Soldering Considerations for Power Modules (Rev. C) | PDF | HTML | 2024/03/14 | |
| Selection guide | Innovative DC/DC Power Modules Selection Guide (Rev. D) | 2021/10/14 | ||
| Application note | Introduction to HVDC Architecture and Solutions for Control and Protection (Rev. B) | PDF | HTML | 2021/09/07 | |
| Application note | Soldering Requirements for BQFN Packages (Rev. C) | 2020/03/05 | ||
| White paper | Simplify low EMI design with power modules | 2017/11/20 | ||
| Application note | Working With QFN Power Modules (Rev. A) | 2017/06/08 | ||
| Application note | How to Configure LMZ30604 Power Module with Ceramic Capacitor (Rev. A) | 2016/11/01 | ||
| EVM User's guide | Using the LMZ30606EVM-003, LMZ30604EVM-001, LMZ30602EVM-002 (Rev. A) | 2014/03/06 | ||
| Application note | Adjusting LMZ3 Output Voltage with LM10010/1 | 2014/02/11 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
LMZ30606EVM-003 — 2.95V~6V, 6A 스텝다운 전원 모듈 평가 보드
TIDA-010011 — 보호 릴레이 프로세서 모듈을 위한 고효율 전원 공급 장치 아키텍처 레퍼런스 설계
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| B1QFN (RKG) | 39 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치