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비교 대상 장치와 유사한 기능
LMZ31707
- Complete integrated power solution allows
small footprint, low-profile design - 10-mm × 10-mm × 4.3-mm package
- Pin compatible with LMZ31710 and LMZ31704
- Efficiencies up to 95%
- Eco-mode™ / light load efficiency (LLE)
- Wide-output voltage adjust
0.6 V to 5.5 V, with 1% reference accuracy - Supports parallel operation for higher current
- Optional split power rail allows
input voltage down to 2.95 V - Adjustable switching frequency
(200 kHz to 1.2 MHz) - Synchronizes to an external clock
- Provides 180° out-of-phase clock signal
- Adjustable slow start
- Output voltage sequencing / tracking
- Power good output
- Programmable undervoltage lockout (UVLO)
- Overcurrent and overtemperature protection
- Pre-Bias output start-up
- Operating temperature range: –40°C to +85°C
- Enhanced thermal performance: 13.3°C/W
- Meets EN55022 Class B emissions
- Integrated shielded inductor
- Create a custom design using the LMZ31707 with the WEBENCH® Power Designer
The LMZ31707 SIMPLE SWITCHER® power module is an easy-to-use integrated power solution that combines a 7-A DC-DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution allows as few as three external components and eliminates the loop compensation and magnetics part selection process.
The 10-mm × 10-mm × 4.3-mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design. Achieves greater than 95% efficiency and excellent power dissipation capability with a thermal impedance of 13.3°C/W. The LMZ31707 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering a wide range of ICs and systems. Advanced packaging technology affords a robust and reliable power solution compatible with standard QFN mounting and testing techniques.
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기술 자료
설계 및 개발
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LMZ31707EVM-002 — LMZ31707 2.95V~17V, 7A 스텝다운 전력 모듈 평가 보드
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
B3QFN (RVQ) | 42 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치