LP5904
- Stable with 1.0 µF Ceramic Input and Output Capacitors
- No Noise Bypass Capacitor Required
- Remote Output Capacitor Placement
- Thermal-overload and Short-circuit Protection
- –40°C to +125°C Junction Temperature Range for Operation
Key Specifications
- Input Voltage Range … 2.2V to 5.5V
- Output Voltage Range … 1.2V to 4.4V
- Output Current … 200 mA
- Low Output Voltage Noise at
200 mA … 6.5µVRMS - PSRR … 78 dB at 1kHz
- Output Voltage Tolerance … ± 2%
- Virtually Zero IQ (Disabled) … <1 µA
- Very Low IQ (Enabled) … 11 µA
- Startup Time … 85 µs
- Low Dropout … 95 mV typ
Package
- 4-Bump DSBGA (lead free)
0.815 mm × 0.815 mm × 0.600 mm
The LP5904 is a linear regulator capable of supplying 200 mA output current. Designed to meet the requirements of RF/ Analog circuits, the LP5904 device provides low noise, high PSRR, low quiescent current, and low line transient response figures. Using new innovative design techniques the LP5904 offers class-leading device noise performance without a noise bypass capacitor and the ability for remote output capacitor placement. An active pulldown circuit with a 280Ω resistor is wired from the output to ground pins to quickly discharge output when the device is disabled (VEN = low).
The device is designed to work with a 1.0 µF input and a 1.0 µF output ceramic capacitor. (No Bypass Capacitor is required.)
The device is available in a DSBGA package. For other package options contact your local TI sales office.
This device is available between 1.2V and 4.4V in
25 mV steps. Please contact Texas Instruments Sales for specific voltage option needs.
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | LP5904 Ultra Low Noise 200mA Linear Reg for RF/Analog Circuits datasheet (Rev. G) | 2013/04/17 | |
| Selection guide | Power Management Guide 2018 (Rev. R) | 2018/06/25 | ||
| User guide | AN-2161 LP5904 DSBGA Evaluation Board Information (Rev. A) | 2013/04/30 | ||
| Application note | AN-2146 Power Design for SDI and Other Noise-Sensitive Devices (Rev. A) | 2013/04/26 |
설계 및 개발
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| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| DSBGA (YFQ) | 4 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치