SN65HVD09-EP
- Designed to Operate at up to 20 Million Data Transfers
per Second on Each RS-422/RS-485 Channel - SN65HVD09 Packaged in Thin Shrink Small-Outline Package
with 0.5-mm Pin Pitch - ESD Protection on Bus Pins Exceeds 12kV
- Low Disabled Supply Current 8 mA Typ
- Thermal Shutdown Protection
- Positive- and Negative-Current Limiting
- Power-Up/Down Glitch Protection
The SN65HVD09 is a 9-channel RS-422 / RS-485 transceiver suitable for industrial applications. It offers improved switching performance, a small package, and high ESD protection. The precise skew limits ensures that the propagation delay times, not only from channel-to-channel but from device-to-device, are closely matched for the tight skew budgets associated with high-speed parallel data buses.
Patented thermal enhancements are used in the thin shrink, small-outline package (TSSOP), allowing operation over the industrial temperature range. The TSSOP package offers very small board area requirements while reducing the package height to 1 mm. This provides more board area and allows component mounting to both sides of the printed circuit boards for low-profile, space-restricted applications such as small form-factor hard disk drives.
The HVD09 can withstand electrostatic discharges exceeding 12 kV using the human-body model, and 600 V using the machine model on the RS-485 I/O terminals. This provides protection from the noise that can be coupled into external cables. The other terminals of the device can withstand discharges exceeding 4 kV and 400 V respectively.
Each of the nine half-duplex channels of the HVD09 is designed to operate with either RS-422 or RS-485 communication networks.
The SN65HVD09 is characterized for operation from 40°C to 85°C.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | DUAL HIGH-SPEED DIFFERENTIAL LINE DRIVER. datasheet | 2011/12/20 | |
* | VID | SN65HVD09-EP VID V6212607 | 2016/06/21 |
설계 및 개발
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패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
TSSOP (DGG) | 56 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치