SN65LVDS387
- Four (’391), Eight (’389), or Sixteen (’387) Line
Drivers Meet or Exceed the Requirements of ANSI
EIA/TIA-644 Standard - Designed for Signaling Rates Up to 630 Mbps
With Very Low Radiation (EMI) - Low-Voltage Differential Signaling With Typical
Output Voltage of 350 mV and a 100-Ω Load - Propagation Delay Times Less Than 2.9 ns
- Output Skew Is Less Than 150 ps
- Part-to-Part Skew Is Less Than 1.5 ns
- 35-mW Total Power Dissipation in Each Driver
Operating at 200 MHz - Driver Is High-Impedance When Disabled or With
VCC < 1.5 V - SN65’ Version Bus-Pin ESD Protection Exceeds
15 kV - Packaged in Thin Shrink Small-Outline Package
With 20-mil Pin Pitch - Low-Voltage TTL (LVTTL) Logic Inputs Are 5-V
Tolerant
This family of 4, 8, and 16 differential line drivers implements the electrical characteristics of low-voltage differential signaling (LVDS). This signaling technique lowers the output voltage levels of 5-V differential standard levels (such as EIA/TIA-422B) to reduce the power, increase the switching speeds, and allow operation with a 3.3-V supply rail. Any of the 16 current-mode drivers will deliver a minimum differential output voltage magnitude of 247 mV into a 100-Ω load when enabled.
When disabled, the driver outputs are high-impedance. Each driver input (A) and enable (EN) have an internal pulldown that will drive the input to a low level when open-circuited.
The SN65LVDS387, SN65LVDS389, and SN65LVDS391 devices are characterized for operation from –40°C to 85°C. The SN75LVDS387, SN75LVDS389, and SN75LVDS391 devices are characterized for operation from 0°C to 70°C.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | SNx5LVDS3xx High-Speed Differential Line Drivers datasheet (Rev. G) | PDF | HTML | 2016/01/14 |
Application brief | How to Support 1.8-V Signals Using a 3.3-V LVDS Driver/Receiver + Level-Shifter | 2018/12/28 | ||
Application brief | LVDS to Improve EMC in Motor Drives | 2018/09/27 | ||
Application brief | How Far, How Fast Can You Operate LVDS Drivers and Receivers? | 2018/08/03 | ||
Application brief | How to Terminate LVDS Connections with DC and AC Coupling | 2018/05/16 | ||
Application note | Using Signaling Rate and Transfer Rate (Rev. A) | 2005/02/07 | ||
User guide | 16-Channel LVDS Driver/Receiver Evaluation Module | 2000/06/27 | ||
Application note | An Overview of LVDS Technology | 1998/10/05 |
설계 및 개발
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SN65LVDS387EVM — 16채널 LVDS 드라이버 평가 모듈
We have designed easy-to-use evaluation modules (EVM) for our 16-channel low-voltage differential signaling (LVDS) driver and receivers. Flexibility has been designed into these EVMs so they can be set up in a point-to-point topology (1 driver to 1 receiver) or a multidrop topology (1 driver (...)
PSPICE-FOR-TI — TI 설계 및 시뮬레이션 툴용 PSpice®
TI 설계 및 시뮬레이션 환경용 PSpice는 기본 제공 라이브러리를 이용해 복잡한 혼합 신호 설계를 시뮬레이션할 수 있습니다. 레이아웃 및 제작에 (...)
TINA-TI — SPICE 기반 아날로그 시뮬레이션 프로그램
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
TSSOP (DGG) | 64 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
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