SN65MLVD047A
- Differential line drivers for 30Ω to 55Ω loads and data rates(1) up to 200Mbps, clock frequencies up to 100MHz
- Supports multipoint bus architectures
- Operates from a single 3.3V supply
- Characterized for operation from –40°C to 85°C
- 16-pin SOIC (JEDEC MS-012) and 16-pin TSSOP (JEDEC MS-153) packaging
(1)The data rate of a line is the number of voltage transitions that are made per second expressed in the units bps (bits per second).
The SN65MLVD047A is a quadruple line driver that complies with the TIA/EIA-899 standard, Electrical Characteristics of Multipoint-Low-Voltage Differential Signaling (M−LVDS). The output current of this M−LVDS device has been increased, in comparison to standard LVDS compliant devices, in order to support doubly terminated transmission lines and heavily loaded backplane bus applications. Backplane applications generally require impedance matching termination resistors at both ends of the bus. The effective impedance of a doubly terminated bus can be as low as 30Ω due to the bus terminations, as well as the capacitive load of bus interface devices. SN65MLVD047A drivers allow for operation with loads as low as 30Ω. The SN65MLVD047A devices allow for multiple drivers to be present on a single bus. SN65MLVD047A drivers are high impedance when disabled or unpowered. Driver edge rate control is incorporated to support operation. The M−LVDS standard allows up to 32 nodes (drivers and/or receivers) to be connected to the same media in a backplane when multiple bus stubs are expected from the main transmission line to interface devices. The SN65MLVD047A provides 9kV ESD protection on all bus pins.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | SN65MLVD047A Multipoint-LVDS Quad Differential Line Driver datasheet (Rev. B) | PDF | HTML | 2024/03/05 |
Application note | An Introduction to M-LVDS and Clock and Data Distribution Applications (Rev. C) | PDF | HTML | 2023/06/22 | |
Application brief | How Far, How Fast Can You Operate MLVDS? | 2018/08/06 | ||
Application note | SPI-Based Data Acquisition/Monitor Using the TLC2551 Serial ADC (Rev. A) | 2001/11/20 |
설계 및 개발
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패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
SOIC (D) | 16 | Ultra Librarian |
TSSOP (PW) | 16 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
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